Design and characterization of differential Signal Integrity interconnects at Millimeter-Wave PCB

被引：0

作者：

Hu, Kaisheng ^{[1
]}

机构：

[1] Ciena, Signal & Power Integr, Ottawa, ON, Canada

来源：

2020 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND SIGNAL & POWER INTEGRITY VIRTUAL SYMPOSIUM(IEEE EMC+SIPI) | 2020年

关键词：

Transmission line; millimeter wave; differential TRL; Transition; calibration; TDR; de-embedding; Surface roughness; interconnection; 2x-Thru; skew;

D O I：

10.1109/emcsi38923.2020.9191540

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, a Signal Integrity test board is designed to evaluate differential calibration and de-embedding methods at millimeter-Wave frequency band: Differential Crosstalk TRL (Thru-Reflect-Line) and Differential 2x-Thru de-embedding. For DUT's result, S21 phase delay are same, but differential Crosstalk TRL shows non-causality issue together with higher error at S21 amplitude. Finally 2x-Thru is selected at several typical de-embedding scenarios: PCB parameters extraction (Dk, Df and Surface Roughness) up to 67 GM; Ultra-low loss PCB material evaluation (Panasonic Meg 7, TUC TU933+, Nelco MW4000 and Isola Tachyon-100G); Multi-channel skew test (less than 1 ps) with one port de-embedding.

引用

页码：90 / 95

页数：6

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