WAFER-SCALE ENCAPSULATED SAW TEMPERATURE AND PRESSURE SENSORS FOR HARSH ENVIRONMENTS

被引：4

作者：

Ng, Eldwin J. ^{[1
]}

Sharma, Jaibir ^{[1
]}

Ching, Eva Wai Leong ^{[1
]}

Wu, Guoqiang ^{[1
]}

Pohl, Didier ^{[2
]}

Vancauwenberghe, Olivier ^{[2
]}

机构：

[1] Inst Microelect, Singapore, Singapore

[2] Paris Saclay, Safran Tech, Safran Sensing Syst, Paris, France

来源：

2021 34TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2021) | 2021年

关键词：

Surface Acoustic Wave (SAW); Temperature Sensors; Pressure Sensors; Wafer-scale Encapsulation;

D O I：

10.1109/MEMS51782.2021.9375369

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Passive SAW sensors do not require circuitry or power and are ideal for harsh environments or rotating machinery. MN-based thin film SAW resonators for temperature and pressure sensors have been developed in this work using AlGe wafer-scale encapsulation for device protection, pressure reference, high stability, and small size. Temperature and pressure co-testing of both sensors up to 160 degrees C and 60 bar revealed similar to 1% full-scale accuracy.

引用

页码：370 / 373

页数：4

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