Cyclic twin nucleation in tin-based solder alloys

被引：181
作者：
Lehman, L. P. [1 ]
Xing, Y. [1 ]
Bieler, T. R. [2 ]
Cotts, E. J. [1 ]
机构：
[1] SUNY Binghamton, Binghamton, NY 13902 USA
[2] Michigan State Univ, E Lansing, MI 48824 USA
来源：
ACTA MATERIALIA | 2010年 / 58卷 / 10期
关键词：
Undercooling solidification; Nucleation; Twinning; Single crystal growth; Electron backscattering diffraction (EBSD); Solidification microstructure; GROWTH; SOLIDIFICATION; SN; TEMPERATURE; SIZE;
D O I：
10.1016/j.actamat.2010.01.030
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The microstructure and Sn crystal orientations of lead-free solder alloys such as near-eutectic SnAgCu have a significant influence on the mechanical response of a solder joint to service conditions. Thus solidification processes were examined in SnAgCu solder joints. Distinct evidence of sixfold cyclic growth twinning of Sn during solidification from the melt was observed in Sn-Ag, SAC and Sn-Cu solders. Three orientations of Sn grains, each having a common < 1 0 0 > direction, were found in each of these systems, though the morphologies of these cyclic twinned microstructures differed. Analysis of dendrite arm spacing in cyclically twined structures with a beach ball morphology implies that the common < 1 0 0 > axis intersects with the region of the nucleation event. Models are presented for two pseudo/metastable hexagonal unit cells based upon {1 0 1} or {3 0 1} twins that introduce the cyclic twinning structure at the nucleation stage. Formation of these hexagonal unit cells may be facilitated by the presence of alloy elements. Subsequent epitaxial growth of the tetragonal unit cell on this nucleus can account for all three types of morphologies observed in microstructures of Sn-rich solder alloys. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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收藏
页码：3546 / 3556
页数：11
相关论文
共 24 条
[1]  
ABBASCHIAN R, 2010, PHYS METALLURGY PRIN, P432
[2]  
[Anonymous], 1998, FUNDAMENTALS SOLIDIF
[3]   The effect of Sn grain number and orientation on the shear fatigue life of SnAgCu solder joints [J].
Arfaei, B. ;
Xing, Y. ;
Woods, J. ;
Wolcott, J. ;
Tumne, P. ;
Borgesen, P. ;
Cotts, E. .
58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, :459-+
[4]  
ARFAEI B, COMMUNICATION
[5]   Correlations Between the Microstructure and Fatigue Life of Near-Eutectic Sn-Ag-Cu Pb-Free Solders [J].
Arfaei, Babak ;
Cotts, Eric .
JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (12) :2617-2627
[6]   Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints [J].
Bieler, T. R. ;
Jiang, H. ;
Lehman, L. P. ;
Kirkpatrick, T. ;
Cotts, E. J. .
56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, :1462-+
[7]   Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints [J].
Bieler, Thomas R. ;
Jiang, Hairong ;
Lehman, Lawrence P. ;
Kirkpatrick, Tim ;
Cotts, Eric J. ;
Nandagopal, Bala .
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2008, 31 (02) :370-381
[8]   The phase-field method: Simulation of alloy dendritic solidification during recalescence [J].
Boettinger, WJ ;
Warren, JA .
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1996, 27 (03) :657-669
[9]   Pb-free solder:: New materials considerations for microelectronics processing [J].
Borgesen, Peter ;
Bieler, Thomas ;
Lehman, L. P. ;
Cotts, E. J. .
MRS BULLETIN, 2007, 32 (04) :360-365
[10]   HETEROGENEOUS NUCLEATION IN ENTRAINED SN DROPLETS [J].
BOSWELL, PG ;
CHADWICK, GA .
ACTA METALLURGICA, 1980, 28 (02) :209-221
123