Kinetic process of oxidative leaching of chalcopyrite under low oxygen pressure and low temperature

被引：31

作者：

Qiu Ting-sheng ^{[1
]}

Nie Guang-hua

Wang Jun-feng

Cui Li-feng

机构：

[1] Jiangxi Univ Sci & Technol, Sch Environm & Architectural Engn, Ganzhou 341000, Peoples R China

[2] Guizhou Univ, Sch Mineral Engn, Guiyang 550003, Peoples R China

来源：

TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA | 2007年 / 17卷 / 02期

基金：

中国国家自然科学基金;

关键词：

chalcopyrite; kinetics; pressure oxidation; sodium chloride hydroxide medium; leaching;

D O I：

10.1016/S1003-6326(07)60108-3

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

Kinetic process of oxidative leaching of chalcopyrite in chloride acid hydroxide medium under oxygen pressure and low temperature was investigated. The effect on leaching rate of chalcopyrite caused by these factors such as ore granularity, vitriol concentration, sodium chloride concentration, oxygen pressure and temperature was discussed. The results show that the leaching rate of chalcopyrite increases with decreasing the ore granularity. At the early stage of oxidative reaction, the copper leaching rate increases with increasing the oxygen pressure and dosage of vitriol concentration, while oxygen pressure affects leaching less at the later stage. At low temperature, the earlier oxidative leaching process of chalcopyrite is controlled by chemical reactions while the later one by diffusion. The chalcopyrite oxidative leaching rate has close relation with ion concentration in the leaching solution. The higher ion concentration is propitious for chalcopyrite leaching.

引用

页码：418 / 422

页数：5

共 15 条

[1] Kinetics of chalcopyrite dissolution by hydrogen peroxide in sulphuric acid [J].