Three-Dimensional Stretchable Microelectronics by Projection Microstereolithography (PμSL)

被引:34
作者
Wang, Yuejiao [1 ,2 ]
Li, Xiang [2 ,3 ]
Fan, Sufeng [1 ,2 ]
Feng, Xiaobin [1 ,2 ]
Cao, Ke [4 ]
Ge, Qi [5 ]
Gao, Libo [4 ]
Lu, Yang [1 ,2 ,3 ]
机构
[1] City Univ Hong Kong, Dept Mech Engn, Kowloon, Hong Kong 999077, Peoples R China
[2] City Univ Hong Kong, Shenzhen Res Inst, Nanomfg Lab NML, Shenzhen 51805, Peoples R China
[3] CityU Xidian Joint Lab Micro Nanomfg, Shenzhen 518057, Peoples R China
[4] Xidian Univ, Sch Mechanoelect Engn, Xian 710071, Peoples R China
[5] Southern Univ Sci & Technol, Dept Mech & Energy Engn, Shenzhen 518055, Peoples R China
基金
中国国家自然科学基金;
关键词
stretchable electronics; flexible electronics; 3D microelectronics; 3D printing; advanced manufacturing; 3D; MICROSTRUCTURES; DESIGN; FILMS; SOFT;
D O I
10.1021/acsami.0c20162
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Stretchable and flexible electronics conformal to human skin or implanted into biological tissues has attracted considerable interest for emerging applications in health monitoring and medical treatment. Although various stretchable materials and structures have been designed and manufactured, most are limited to two-dimensional (2D) layouts for interconnects and active components. Here, by using projection microstereolithography (P mu SL)-based three-dimensional (3D) printing, we introduce a versatile microfabrication process to push the manufacturing limit and achieve previously inaccessible 3D geometries at a high resolution of 2 mu m. After coating the printed microstructures with thin Au films, the 3D conductive structures offer exceptional stretchability (similar to 130%), conformability, and stable electrical conductivity (<5% resistance change at 100% tensile strain). This fabrication process can be further applied to directly create complicated 3D interconnect networks of sophisticated active components, as demonstrated with a stretchable capacitive pressure sensor array here. The proposed scheme allows a simple, facile, and scalable manufacturing route for complex, integrated 3D flexible electronic systems.
引用
收藏
页码:8901 / 8908
页数:8
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