Improved adhesion of DLC films on copper substrates by preimplantation

被引：16
作者：
Flege, S. [1 ]
Hatada, R. [1 ]
Ensinger, W. [1 ]
Baba, K. [2 ]
机构：
[1] Tech Univ Darmstadt, D-64287 Darmstadt, Germany
[2] Ind Technol Ctr Nagasaki, Appl Technol Div, Omura, Japan
来源：
SURFACE & COATINGS TECHNOLOGY | 2014年 / 256卷
关键词：
DLC; Adhesion; Copper; Implantation; PBII; DIAMOND-LIKE CARBON; SOURCE ION-IMPLANTATION; METHANE PLASMA; COATINGS; SURFACE; DEPOSITION; METALS; LAYER; STEEL; AR+;
D O I：
10.1016/j.surfcoat.2013.12.020
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The adhesion of diamond-like carbon (DLC) films on copper substrates is usually very poor. However, the adhesive strength of the films can be improved by a preimplantation step. With plasma based ion implantation and deposition, the preimplantation step and the film deposition can be realized with the same experimental setup. The effect of the implantation of several different gaseous species (N-2,O-2, Ar, CO2, C2H4, and air) at 10 kV was investigated. For O-2, N-2 and C2H4 the influence of the pulse voltage (-5, -10, -15 kV) was examined. The samples were characterized by elemental depth profiling (XPS, SIMS), and the adhesion was evaluated with a pull tester. Most of the preimplantation treatments increase the adhesion of the DLC films on the copper substrates considerably to values of 10-15 MPa. The best result was obtained with -15 kV oxygen preimplantation. (C) 2013 Elsevier B.V. All rights reserved.
引用
收藏
页码：37 / 40
页数：4
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