Sapphire joining using Ag70.5Cu27.5Ti2 brazing filler metal

被引：0

作者：

Ning, HL ^{[1
]}

Huang, FX ^{[1
]}

Ma, JS ^{[1
]}

Geng, ZT ^{[1
]}

Han, ZD ^{[1
]}

机构：

[1] Tsing Hua Univ, Dept Mat Sci & Engn, Beijing 100084, Peoples R China

来源：

RARE METAL MATERIALS AND ENGINEERING | 2003年 / 32卷 / 03期

关键词：

sapphire; active brazing packaging; joining strength; leakage rate;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Sapphire and hot-pressed 99% Al2O3 ceramic were joined using Ag70.5Cu20.5Ti2 brazing filler metal at 845degreesC to 860degreesC for 6 min in a vacuum. The interface reaction between the Ag70.5Cu20.5Ti2 alloy and ceramic or sapphire during brazing are reported. The joining strength and the airtight of the specimen are influenced by the surface condition of alumina ceramic as well as the welding factors.

引用

页码：236 / 239

页数：4

共 10 条

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