XPS study of CMP mechanisms of NiP coating for hard disk drive substrates

被引：52

作者：

Qi, Zuqiang ^{[1
]}

Lee, Weiming ^{[1
]}

机构：

[1] Shenzhen Kaifa Magnet Recording Co Ltd, R&D Dept, Shenzhen 518035, Peoples R China

来源：

TRIBOLOGY INTERNATIONAL | 2010年 / 43卷 / 04期

关键词：

Chemical mechanical polishing (CMP); X-ray photoelectron spectroscope (XPS); Passivation; SILICA SLURRY; NICKEL; PLANARIZATION; OXIDATION; BEHAVIOR; FILMS; WATER; METAL; MODEL;

D O I：

10.1016/j.triboint.2009.11.007

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

Chemical mechanical polishing (CMP) mechanisms of NiP coating plated on Al-Mg alloy substrates have been investigated with an X-ray photoelectron spectroscope (XPS). The XPS results indicate that after cleaning, the disk surface contains a thin layer of Ni(CH)(2) and P2O3, followed by a thin NiO and P2O3 layer. It is also deduced that during polishing, the disk surface has an oxidization layer with Ni2+ and p(3+) species. The experimental investigations reveal that the CMP mechanisms involve a simultaneous process of surface chemical passivation and nano-particle wear. (C) 2009 Elsevier Ltd. All rights reserved.

引用

页码：810 / 814

页数：5

共 25 条

[1] Evaluation of manufacturing handling characteristics of hydrogen peroxide-based tungsten CMP slurry [J].

Bare, JP ;

Johl, B .

TWENTY THIRD IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1998, :164-171

[2] A dishing model for STI CMP process [J].

Chang, SH .

MICROELECTRONIC ENGINEERING, 2005, 82 (02) :136-142

[3] CMP characteristics and optical property of ITO thin film by using silica slurry with a variety of process parameters [J].

Choi, Gwon-Woo ;

Lee, Kang-Yeon ;

Kim, Nam-Hoon ;

Park, Jm-Seong ;

Seo, Yong-Jin ;

Lee, Woo-Sun .

MICROELECTRONIC ENGINEERING, 2006, 83 (11-12) :2213-2217

[4]

FISCHER TE, 1988, ANNU REV MATER SCI, V18, P303

[5] Influence of a chromium ion implantation on the passive behaviour of nickel in artificial sea-water: An EIS and XPS study [J].

Girault, P ;

Grosseau-Poussard, JL ;

Dinhut, JF ;

Marechal, L .

NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2001, 174 (04) :439-452

[6] New interpretations of XPS spectra of nickel metal and oxides [J].

Grosvenor, Andrew P. ;

Biesinger, Mark C. ;

Smart, Roger St. C. ;

McIntyre, N. Stewart .

SURFACE SCIENCE, 2006, 600 (09) :1771-1779

[7] A kinematic analysis of disk motion in a double sided polisher for chemical mechanical planarization (CMP) [J].

Kasai, Toshi .

TRIBOLOGY INTERNATIONAL, 2008, 41 (02) :111-118

[8] CHEMICAL-MECHANICAL POLISHING FOR FABRICATING PATTERNED W METAL FEATURES AS CHIP INTERCONNECTS [J].

KAUFMAN, FB ;

THOMPSON, DB ;

BROADIE, RE ;

JASO, MA ;

GUTHRIE, WL ;

PEARSON, DJ ;

SMALL, MB .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1991, 138 (11) :3460-3465

[9] CMP of hard disk substrate using a colloidal SiO2 slurry:: preliminary experimental investigation [J].

Lei, H ;

Luo, JB .

WEAR, 2004, 257 (5-6) :461-470

[10] Wear phenomena in chemical mechanical polishing [J].

Liang, H ;

Kaufman, F ;

Sevilla, R ;

Anjur, S .

WEAR, 1997, 211 (02) :271-279

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