Thermomechanical Analysis of Film-on-Substrate System With Temperature-Dependent Properties

被引：8
作者：
Huang, YongAn [1 ]
Yin, ZhouPing [1 ]
Xiong, YouLun [1 ]
机构：
[1] Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Peoples R China
来源：
JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME | 2010年 / 77卷 / 04期
基金：
中国国家自然科学基金; 中国博士后科学基金;
关键词：
buckling; finite element analysis; sensitivity analysis; stress-strain relations; substrates; THIN-FILM; MECHANICS; SILICON;
D O I：
10.1115/1.4000927
中图分类号：
O3 [力学];
学科分类号：
08 ; 0801 ;
摘要：
Thermomechanical analysis of global and local buckling is presented to show temperature effects on the stress/strain and shape of a film-on-substrate system. First, the strain is expressed as a function of three key temperatures (room, working, and deposit temperatures). Through sensitivity analysis on temperature, polydimethylsiloxane (PDMS) selection is determined to theoretically design film-on-substrate systems with the minimum variation in stress caused by temperatures. Then, the wrinkling behaviors are studied to establish the relationships of critical strain, wavelength, and amplitude with temperature. In addition, the critical working temperature is determined for local buckling. The approximate semi-analytical solution and the finite element simulation are compared by the use of a two-dimensional case of film on a half-space substrate.
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页码：1 / 9
页数：9
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