Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder

被引：5
作者：
Amli, S. F. Muhd [1 ]
Salleh, M. A. A. Mohd [1 ]
Ramli, M. I. I. [1 ]
Aziz, M. S. Abdul [2 ]
Yasuda, H. [3 ]
Chaiprapa, J. [4 ]
Nogita, K. [5 ]
机构：
[1] Univ Malaysia Perlis, Fac Chem Engn Technol, Ctr Excellence Geopolymer Green Technol CeGeoGTec, Taman Muhibbah, Arau, Perlis, Malaysia
[2] Univ Sains Malaysia, Sch Mech Engn, Nibong Tebal 14300, Penang, Malaysia
[3] Kyoto Univ, Dept Mat Sci & Engn, Sakyo Ku, Kyoto 6068501, Japan
[4] Synchrotron Light Res Inst, Muang, Nakhon Ratchasima 3000, Thailand
[5] Univ Queensland, Sch Mech & Min Engn, Nihon Super Ctr Mfg Elect Mat NS CMEM, Brisbane, Qld 4072, Australia
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2022年 / 33卷 / 17期
关键词：
LEAD-FREE SOLDERS; INTERFACIAL REACTIONS; CU; RELIABILITY; SUBSTRATE; GROWTH; CU6SN5;
D O I：
10.1007/s10854-022-08353-z
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This manuscript details the investigation into the influences of immersion silver (ImAg) and immersion tin (ImSn) surface finish reflowed with the Sn-3.0Ag-0.5Cu (SAC305) solder via microstructure observation, phase and thermal analysis, and the high-speed shear test. Synchrotron radiography and synchrotron micro-XRF were utilised to elucidate the primary Cu6Sn5 intermetallic compound formation and elemental mapping distributions, respectively. The ImSn surface finish plated on the Cu substrate resulted in smaller-sized and more numerous primary Cu6Sn5 intermetallics in the solder joint, compared to SAC305/ImAg which has higher Ag and Cu contents. The mechanical properties of SAC305/ImSn resulted in a higher solder joint strength relative to that of SAC305/ImAg.
引用
收藏
页码：14249 / 14263
页数：15
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