Microfabrication of an electromagnetic power relay using SU-8 based UV-LIGA technology

被引：35
|
作者：
Williams, JD [1 ]
Wang, W [1 ]
机构：
[1] Louisiana State Univ, Dept Mech Engn, Baton Rouge, LA 70803 USA
来源：
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2004年 / 10卷 / 10期
关键词：
D O I：
10.1007/s00542-004-0396-1
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Most of the MEMS relays reported in the field now are based on silicon fabrication and cannot be used for power applications. In this paper, we report a research effort to microfabricate an electromagnetic relay for power applications using a multilayer UV-LIGA process. A mechanically wrapped coil was used and very simple design for the magnetic circuit was adopted to increase the design flexibility and performances. The broad material selection and the capability of making high aspect ratio microstructures of the UV-LIGA make the technology best suited for fabricating microelectromechanical relays for power applications. The prototype relay has a truly three-dimensional structure and very suitable for large power capacity applications.
引用
收藏
页码：699 / 705
页数：7
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