Methods to reduce radiation from split ground planes in RF and mixed signal packaging structures

被引:22
作者
Moran, TE [1 ]
Virga, KL
Aguirre, G
Prince, JL
机构
[1] Agilent Technol, Santa Rosa, CA 95403 USA
[2] Kyocera Amer, Res & New Prod Dev Grp, San Diego, CA 92123 USA
[3] Univ Arizona, Dept Elect & Comp Engn, Tucson, AZ 85721 USA
来源
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2002年 / 25卷 / 03期
关键词
coupling; EMI; FDTD; mixed signal packaging; radiated emissions;
D O I
10.1109/TADVP.2002.805997
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Split ground planes are sometimes used in RF and mixed signal packages in order to isolate the RF and analog circuits from the digital circuits. Undesired radiation in a packaging environment may occur when a signal trace is routed over a slot in the ground plane. This paper examines and investigates ways to eliminate signal coupling into split ground plane structures and assesses the impact of this reduced coupling on signal integrity in a packaging environment. Suggested methods to reduce coupling of energy into the slot are to alter the shape of the slot with RE chokes or corrugations.
引用
收藏
页码:409 / 416
页数:8
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