Demolding of high aspect ratio polymeric micro-patterning

UV embossing for polymeric micro-patterning thin film is an emerging replication technique. Ibis paper investigates UV curable multifunctional acrylates pre-polymer resin patterned by a microstructured mold and subsequently cured by UV irradiation. To further enhance this duplication method for high aspect ratio production, demolding must be reliable and repeatable without damage to the embossing or mold. Previously, it has been reported that UV embossed patterns for aspect ratios as high as 14 have been achieved experimentally. Finite element analyses for patterns with aspect ratios of 5 using parallel demolding between two parallel plates have also been reported. However, the parallel demolding method may not be suitable for large area patterns as forces generated were high. As such, an alternative demolding method, namely peel demolding, for micropatterns with an aspect ratio of 14 was investigated and key parameters identified. The parameters governing the demolding process were the peel angle, the pre-crack condition, shrinkage, interface fracture toughness, tensile strength and modulus of polymer. A pre-crack between the polymer and mold was introduced before peel demolding. Numerical analyses in terms of Cohesive Zone Modeling (CZM) were used to simulate the demolding process. Shrinkage caused by UV exposure was represented by thermal strain effects and the fully cured polymer was peeled off using displacement control. The ultimate tensile strength (U.T.S) of the cured polymer was used as a failure criterion. The stresses involved were crucial for determining clean demolding. As peeling progressed, stresses experienced in the polymer matrix increased rapidly in the region ahead of the crack with little or no stress at the cracked region. When stresses experienced by the polymer were below the U.T.S, demolding was deemed to be successful.