Metallization of polyimide films with enlarged area by conducting the catalyzation in supercritical carbon dioxide

被引:10
作者
Chang, Tso-Fu Mark [1 ,2 ]
Wang, Cheng-Chuan [3 ]
Yen, Chia-Ying [3 ]
Chen, Shin-Hwa [3 ]
Chen, Chun-Yi [1 ,2 ]
Sone, Masato [1 ,2 ]
机构
[1] Tokyo Inst Technol, Precis & Intelligence Lab, Midori Ku, 4259-R2-35 Nagatsuta Cho, Yokohama, Kanagawa 2268503, Japan
[2] Japan Sci & Technol Agcy, CREST, Midori Ku, 4259 Nagatsuta Cho, Yokohama, Kanagawa 2268503, Japan
[3] Ind Technol Res Inst, Mat & Chem Res Labs, 195,Chung Hsing Rd,Sect 4, Hsinchu 31040, Taiwan
关键词
Metallization; Polyimide film; Supercritical carbon dioxide; Catalyzation; Electroless plating; Nickel; POLYMER; EMULSION; SC-CO2;
D O I
10.1016/j.mee.2015.12.006
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This study reports the metallization of polyimide films with enlarged area by conducting the catalyzation step in supercritical CO2. Defect-free Ni coating with high adhesion strength on the polyimide film having dimensions of 12.0 x 4.5 cm(2) was realized using a high pressure vessel with diameter and height of only 4.0 and 4.5 cm, respectively. The ability to conduct the catalyzation of polyimide films having a size larger than size of the reaction cell is a result of the enhanced transport properties caused by the supercritical CO2. With 8 min of plating time, the Ni coating thickness on the polyimide film reached 1.077 mu m, and the resistivity and adhesion strength were 1.4 Omega and 1.5 MPa, respectively. (C) 2015 Elsevier B.V. All rights reserved.
引用
收藏
页码:1 / 4
页数:4
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