High aspect ratio silicon micromachined heat exchanger

被引：0

作者：

Bengtsson, J ^{[1
]}

Wallman, L ^{[1
]}

Laurell, T ^{[1
]}

机构：

[1] Lund Inst Technol, Dept Elect Measurements, S-22100 Lund, Sweden

来源：

MICROREACTION TECHNOLOGY: INDUSTRIAL PROSPECTS | 2000年

关键词：

micro heat exchanger; PN-etch stop; anisotropic; micro machined; silicon;

D O I：

暂无

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

The fabrication process for a silicon micro machined heat exchanger is descibed. A thin walled, 7 mu m, channel structure defined by vertical channels, 360 mu m deep and 220 mu m wide, anisotropically etched in < 110 >-silicon followed by a pn-etch stop process provided a heat exchanger module in the shape of a "square wave" corrugated membrane. The double sided processing provided vertical channels interdigitated from one side to the other giving a counter flow component with rear side fluid access from the front side. The design allows the stacking of multiple elements to obtain a unit with the desired heat sink capacity.

引用

页码：573 / 577

页数：5

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