Soldering Tests with Biodegradable Printed Circuit Boards

被引：0

作者：

Geczy, A. ^{[1
]}

Garami, T. ^{[1
]}

Kovacs, B. ^{[1
]}

Nagy, D. ^{[1
]}

Gal, L. ^{[1
]}

Ruszinko, M. ^{[1
]}

Hajdu, I. ^{[1
]}

机构：

[1] Budapest Univ Technol & Econ, Dept Elect Technol, H-1111 Budapest, Hungary

来源：

2013 IEEE 19TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME) | 2013年

关键词：

biodegradable; PCB; vapour phase soldering; green technology; soldering profiles;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The paper presents soldering tests on biodegradable printed circuit boards (PCB) focusing on different alternative base materials. The aim of the work was to investigate and optimize different low-temperature soldering profiles on cellulose-acetate (CA) and polylactide (PLA) biopolymer-based PCBs with the application of special lead-free solder alloy suited for the temperatures. The investigations were focused on the minimization of the heating effect on the heat-sensitive biopolymers, where on the other hand, sufficient thermal energy is required to melt the solder alloys. The soldering profiles were created with a custom vapour phase soldering (VPS) approach where the heat transfer is controlled with an adaptive height-setting, temperature tracking sample holder. The profiles were evaluated according to their heating factor values. The soldered joints were evaluated with X-Ray microscopy and Shear Tests. The deformation of the PCB tracks was also investigated. The preliminary results reveal the priority of CA for further experiments.

引用

页码：39 / 42

页数：4

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