The microstructure and properties of C and W co-doped NiCr embedded thin film resistors

被引:13
作者
Lai, Li-Fei [1 ,2 ]
Su, Xing-Song [2 ]
Fu, Xian-Zhu [2 ]
Sun, Rong [2 ]
Wong, Ching-Ping [3 ,4 ]
机构
[1] Ningbo Univ Technol, Ningbo 315016, Zhejiang, Peoples R China
[2] Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China
[3] Chinese Univ Hong Kong, Dept Elect Engn, Hong Kong, Hong Kong, Peoples R China
[4] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA
基金
中国国家自然科学基金;
关键词
C and W co-doped NiCr alloy; Embedded resistor; Microstructure; Electrical properties; Corrosion resistance; ELECTRICAL-PROPERTIES; PASSIVE RESISTORS; AMORPHOUS-CARBON; TEMPERATURE; FABRICATION; RESISTIVITY; RESISTANCE; OXIDATION; BEHAVIOR;
D O I
10.1016/j.surfcoat.2014.09.039
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
C and W co-doped NiCr alloy flexible thin films were prepared using closed magnetic field unbalanced magnetron sputtering method on a copper foil substrate. The microstructure, electrical properties, and corrosion resistance of the co-doped NiCr thin film were investigated and analyzed as embedded resistor materials. After co-doping, the alloy thin film embedded resistor materials exhibited considerably lower temperature coefficient of resistance (TCR), larger sheet resistance and higher corrosion resistance comparing to the NiCr alloy thin film embedded resistor materials. (C) 2014 Elsevier B.V. All rights reserved.
引用
收藏
页码:759 / 766
页数:8
相关论文
共 28 条
[1]   RAMAN-SCATTERING OF LASER-DEPOSITED AMORPHOUS-CARBON [J].
BACSA, WS ;
LANNIN, JS ;
PAPPAS, DL ;
CUOMO, JJ .
PHYSICAL REVIEW B, 1993, 47 (16) :10931-10934
[2]   RESISTANCE BEHAVIOR AND INTERDIFFUSION OF LAYERED CUNI-NICR FILMS [J].
BRUCKNER, W ;
SCHUMANN, J ;
BAUNACK, S ;
PITSCHKE, W ;
KNUTH, T .
THIN SOLID FILMS, 1995, 258 (1-2) :236-246
[3]  
Cheng G X, 2001, RAMAN BRILLOUIN SCAT
[4]   Effects of substrate temperature on bonding structure and mechanical properties of amorphous carbon films [J].
Chowdhury, S ;
Laugier, MT ;
Rahman, IZ .
THIN SOLID FILMS, 2004, 447 :174-180
[5]   New approach to laser direct writing active and passive mesoscopic circuit elements [J].
Chrisey, DB ;
Pique, A ;
Fitz-Gerald, J ;
Auyeung, RCY ;
McGill, RA ;
Wu, HD ;
Duignan, M .
APPLIED SURFACE SCIENCE, 2000, 154 (154) :593-600
[6]   Development of thin film resistors for use in multichip modules [J].
Coates, KL ;
Chien, CP ;
Hsiao, YYR ;
Kovach, DJ ;
Tang, CH ;
Tanielian, MH .
1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS, 1998, :490-495
[7]   RAMAN MICROPROBE STUDIES ON CARBON MATERIALS [J].
CUESTA, A ;
DHAMELINCOURT, P ;
LAUREYNS, J ;
MARTINEZALONSO, A ;
TASCON, JMD .
CARBON, 1994, 32 (08) :1523-1532
[8]   Effect of Cr content on mechanical and electrical properties of Ni-Cr thin films [J].
Danisman, M. ;
Cansever, N. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2010, 493 (1-2) :649-653
[9]   INCIPIENT LOCALIZATION AND ELECTRON ELECTRON CORRELATION-EFFECTS IN METALLIC-GLASS ALLOYS [J].
HOWSON, MA .
JOURNAL OF PHYSICS F-METAL PHYSICS, 1984, 14 (03) :L25-L31
[10]   Effect of annealing on the structural and optical properties of heavily carbon-doped ZnO [J].
Huang, He ;
Deng, Z. W. ;
Li, D. C. ;
Barbir, E. ;
Jiang, W. Y. ;
Chen, M. X. ;
Kavanagh, K. L. ;
Mooney, P. M. ;
Watkins, S. P. .
SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2010, 25 (04)