Increase of stress intensity near free-edge of elastic-creeping bi-material interface under a sustained load

被引:1
作者
Ngampungpis, Kittikorn [1 ]
Hirakata, Hiroyuki [2 ]
Kitamura, Takayuki [2 ]
机构
[1] Kyoto Univ, Grad Sch Engn, Sakyo Ku, Kyoto 6068501, Japan
[2] Kyoto Univ, Dept Mech Engn & Sci, Kyoto 6068501, Japan
来源
ENGINEERING PLASTICITY AND ITS APPLICATIONS FROM NANOSCALE TO MACROSCALE, PTS 1 AND 2 | 2007年 / 340-341卷
关键词
small-scale creep (SSC); Large-scale creep (LSC); bad pair bi-material; good pair bi-material; interface edge; stress intensity; stress singularity;
D O I
10.4028/www.scientific.net/KEM.340-341.501
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The transition from SSC to LSC ahead of a crack tip (notch root) or an ordinary interface edge (bad pair) causes stress relaxation and the decrease of stress intensity in general. However, the good pair bi-material and the bad pair bi-material with weak elastic stress singularity in this study show the inverse phenomenon under the transition. The results indicate that the stress near the interface edges of both cases, which have no or low stress singularity at the loading instant, increases and brings about the stress concentration during the transition. In addition, the creep strain distribution in the early stage is different from that occurred in the transition of an ordinary interface edge (bad pair) or a crack tip (notch root).
引用
收藏
页码:501 / +
页数:2
相关论文
共 7 条