Low-cost hybrid photonic integrated circuits using passive alignment techniques

被引：1
|
作者：
Maxwell, Graerrie [1 ]
机构：
[1] CIP Ltd, Martlesham Heath, Adastral Pk, Ipswich IP5 3RE, Suffolk, England
来源：
2006 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2 | 2006年
关键词：
D O I：
10.1109/LEOS.2006.278874
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper describes a platform approach to achieve passive assembly of single-mode photonic components with high performance and low cost. The platform uses mode expanded and precision cleaved active semiconductor devices which are then passively assembled on PLC motherboards.
引用
收藏
页码：98 / +
页数：2
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