Thermal stable honokiol-derived epoxy resin with reinforced thermal conductivity, dielectric properties and flame resistance

被引：56

作者：

Meng, Jingjing ^{[1
]}

Chen, Pengfei ^{[1
]}

Yang, Rui ^{[1
]}

Dai, Linli ^{[1
]}

Yao, Cheng ^{[2
]}

Fang, Zheng ^{[1
]}

Guo, Kai ^{[1
]}

机构：

[1] Nanjing Tech Univ, Coll Biotechnol & Pharmaceut Engn, Nanjing 211816, Peoples R China

[2] Nanjing Tech Univ, Coll Chem & Mol Engn, Nanjing 211816, Peoples R China

来源：

CHEMICAL ENGINEERING JOURNAL | 2021年 / 412卷

基金：

中国国家自然科学基金;

关键词：

Honokiol; Epoxy resin; Thermal stability; Thermal conductivity; Dielectric constant; Flame retardancy;

D O I：

10.1016/j.cej.2021.128647

中图分类号：

X [环境科学、安全科学];

学科分类号：

08 ; 0830 ;

摘要：

To produce renewable and functional epoxy resins, novel polymers were fabricated based on naturally available honokiol. The honokiol-derived (DBDBBB) epoxy resin monomer was firstly reported and cured by diamino diphenyl-sulfone (33DDS and 44DDS). The resultant networks were fabricated via both epoxy resin and polyolefin, and showed excellent thermal stability (T-max up to 451 degrees C), thermal conductivity (similar to 0.743 W/m.K), and high specific heat (5.364 J/g.K) as well as the excellent dielectric constant and loss values (9.74, 0.026) (1 kHz, 25 degrees C). Moreover, the bio-based networks were low flammable. The high-performing DBDBBB/DDS networks surpass the DGEBA analogs, and hence it will be a promising candidate for DGEBA and has great potential application in the electronics and microelectronics industry.

引用

页数：12

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