Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys

被引：30

作者：

Zhao Xiao-yan ^{[1
]}

Zhao Mai-qun ^{[1
]}

Cui Xiao-qing ^{[1
]}

Xu Tian-han ^{[1
]}

Tong Ming-xin ^{[1
]}

机构：

[1] Xian Univ Technol, Sch Mat Sci & Engn, Xian 710048, Peoples R China

来源：

TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA | 2007年 / 17卷 / 04期

关键词：

Sn-Ag-Cu system; lead-free solder alloy; melting point; spreading property; mechanical property;

D O I：

10.1016/S1003-6326(07)60178-2

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

The melting point, spreading property, mechanical properties and microstructures of Sn-3.0Ag-2.8Cu solder alloys added with micro-variable-Ce were studied by means of optical microscopy, scanning electron microscopy(SEM) and energy dispersive X-ray(EDX). The results indicate that the melting point of Sn-3.0Ag-2.8Cu solder is enhanced by Ce addition; a small amount of Ce will remarkably prolong the creep-rupture life of Sn-3.0Ag-2.8Cu solder joint at room temperature, especially when the content of Ce is 0.1%, the creep-rupture life will be 9 times or more than that of the solder joint without Ce addition; the elongation of Sn-3.0Ag-18Cu solder is also obviously improved even up to 15.7%. In sum, the optimum content of Ce is within 0.05%-0.1 %.

引用

页码：805 / 810

页数：6

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