Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems

被引：29

作者：

Phommahaxay, Alain ^{[1
]}

Suhard, Samuel ^{[1
]}

Bex, Pieter ^{[1
]}

Iacovo, Serena ^{[1
]}

Slabbekoorn, John ^{[1
]}

Inoue, Fumihiro ^{[1
]}

Peng, Lan ^{[1
]}

Kennes, Koen ^{[1
]}

Sleeckx, Erik ^{[1
]}

Beyer, Gerald ^{[1
]}

Beyne, Eric ^{[1
]}

机构：

[1] Imec, Leuven, Belgium

来源：

2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2019年

关键词：

Wafer bonding; Dieletric Bonding; Hybrid Bonding; Die to Wafer bonding; Heterogeneous Integration; Temporary Bond Material;

D O I：

10.1109/ECTC.2019.00097

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The recent developments of wafer-to-wafer bonding technology based on direct assembly of inorganic dielectric materials is offering a path for the continuous need for higher integration density and lower interconnect pitches. However, numerous applications could benefit of a higher degree of design flexibility offered by a die-to-wafer approach. The achievement of high yielding die-to-wafer bonding with micron range die overlay is an essential element to unlock the potential of heterogeneous integration.

引用

页码：607 / 613

页数：7

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