A study of localised galvanic replacement of copper and silver films with gold using scanning electrochemical microscopy

被引：21

作者：

O'Mullane, Anthony P. ^{[1
]}

Ippolito, Samuel J. ^{[1
]}

Bond, Alan M. ^{[2
]}

Bhargava, Suresh K. ^{[1
]}

机构：

[1] RMIT Univ, Sch Appl Sci, Melbourne, Vic 3001, Australia

[2] Monash Univ, Sch Chem, Clayton, Vic 3800, Australia

来源：

ELECTROCHEMISTRY COMMUNICATIONS | 2010年 / 12卷 / 05期

关键词：

Galvanic replacement; SECM; Microfabrication; LATERAL CHARGE PROPAGATION; NANOSTRUCTURES; AG; NANOPARTICLE; PATTERNS; SURFACES; HOLLOW;

D O I：

10.1016/j.elecom.2010.02.012

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Galvanic replacement represents a highly significant process for the fabrication of bimetallic materials, but to date its application has been limited to either modification of large area metal surfaces or nanoparticles in solution. Here, the localised surface modification of copper and silver substrates with gold through the galvanic replacement process is reported. This was achieved by generation of a localised flux of AuCl(4)(-) ions from a gold ultramicroelectrode tip which interacts with the unbiased substrate of interest. The extent of modification with gold can be controlled through the tip substrate distance and electrolysis time. (c) 2010 Elsevier B.V. All rights reserved.

引用

页码：611 / 615

页数：5

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