The nucleation-controlled intermetallic grain refinement of Cu-Sn solid-liquid interdiffusion wafer bonding joints induced by addition of Ni particles

被引：26
作者：
Li, Z. L. [1 ,2 ]
Tian, H. [2 ]
Dong, H. J. [1 ]
Guo, X. J. [2 ]
Song, X. G. [1 ,2 ]
Zhao, H. Y. [1 ,2 ]
Feng, J. C. [1 ,2 ]
机构：
[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Heilongjiang, Peoples R China
[2] Harbin Inst Technol, Shandong Prov Key Lab Special Welding Technol, Weihai 264209, Peoples R China
来源：
SCRIPTA MATERIALIA | 2018年 / 156卷
基金：
中国国家自然科学基金;
关键词：
Joining; Intermetallic compound; Heterogeneous nucleation and phase transformation; Grain refinement; MECHANICAL-PROPERTIES; NI/SN/CU SYSTEM; INTERFACIAL REACTIONS; PHASE; NI)(6)SN-5; CU6SN5; (CU; MICROSTRUCTURE; ORIENTATION; MORPHOLOGY;
D O I：
10.1016/j.scriptamat.2018.07.006
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
In this study, Ni particle was validated as an effective grain refiner for the Cu-Sn solid-liquid interdiffusion (SLID) wafer bonding joints, which induced a dispersive non-interfacial nucleation of intermetallic grains, effectively preventing the grain mergence phenomenon. With increasing the Ni particle addition, there were significant reductions in both the (Cu, Ni)(6)Sn-5 grain size and the Cu3Sn layer thickness, 6 wt% addition of Ni particles even led a formation of the intermetallic joints only consisted of (Cu, Ni)(6)Sn-5 grains with an average grain size of 13 mu m. (Cu, Ni)(6)Sn-5 grain refinement could notably enhanced the shear strength of the intermetallic joints. (C) 2018 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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页码：1 / 5
页数：5
相关论文
共 23 条
[1]   The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction [J].
Chen, W. M. ;
Yang, T. L. ;
Chung, C. K. ;
Kao, C. R. .
SCRIPTA MATERIALIA, 2011, 65 (04) :331-334
[2]   Grain morphology evolution and mechanical strength change of intermetallic joints formed in Ni/Sn/Cu system with variety of transient liquid phase soldering temperatures [J].
Dong, H. J. ;
Li, Z. L. ;
Song, X. G. ;
Zhao, H. Y. ;
Tian, H. ;
Liu, J. H. ;
Yan, J. C. .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 705 :360-365
[3]   Grain morphology and mechanical strength of high-melting-temperature intermetallic joints formed in asymmetrical Ni/Sn/Cu system using transient liquid phase soldering process [J].
Dong, H. J. ;
Li, Z. L. ;
Song, X. G. ;
Zhao, H. Y. ;
Yan, J. C. ;
Tian, H. ;
Liu, J. H. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 723 :1026-1031
[4]   Wafer-Level Vacuum Packaging of Smart Sensors [J].
Hilton, Allan ;
Temple, Dorota S. .
SENSORS, 2016, 16 (11)
[5]   The effect of a concentration gradient on interfacial reactions in microburaps of Ni/SnAg/Cu during liquid-state soldering [J].
Huang, Y. S. ;
Hsiao, H. Y. ;
Chen, Chih ;
Tu, K. N. .
SCRIPTA MATERIALIA, 2012, 66 (10) :741-744
[6]   Mechanism of interfacial reaction for the Sn-Pb solder bump with Ni/Cu under-bump metallization in flip-chip technology [J].
Jang, GY ;
Huang, CS ;
Hsiao, LY ;
Duh, JG ;
Takahashi, H .
JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (10) :1118-1129
[7]  
Kulojarvi K., 1998, Microelectronics International, V15, P20, DOI 10.1108/13565369810215582
[8]   Phase equilibria in the Sn-rich corner of the Sn-Cu-Ni ternary alloy system at 240 °C [J].
Li, CY ;
Duh, JG .
JOURNAL OF MATERIALS RESEARCH, 2005, 20 (11) :3118-3124
[9]   Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process [J].
Li, Z. L. ;
Dong, H. J. ;
Song, X. G. ;
Zhao, H. Y. ;
Tian, H. ;
Liu, J. H. ;
Feng, J. C. ;
Yan, J. C. .
ULTRASONICS SONOCHEMISTRY, 2018, 42 :403-410
[10]   Study on the microstructure and mechanical properties of Cu-Sn intermetallic joints rapidly formed by ultrasonic-assisted transient liquid phase soldering [J].
Liu, J. H. ;
Zhao, H. Y. ;
Li, Z. L. ;
Song, X. G. ;
Dong, H. J. ;
Zhao, Y. X. ;
Feng, J. C. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 692 :552-557
123