Stabilizing nanocrystalline materials with dopants

被引:224
作者
Millett, Paul C. [1 ]
Selvam, R. Panneer
Saxena, Ashok
机构
[1] Idaho Natl Lab, Ctr Adv Modeling & Simulat, Idaho Falls, ID 83415 USA
[2] Univ Arkansas, Fayetteville, AR 72701 USA
关键词
molecular dynamics; nanocrystalline materials; grain growth; grain boundary segregation; copper alloys;
D O I
10.1016/j.actamat.2006.11.028
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The enhancement of material properties caused by extremely small grain sizes in metals and ceramics is attractive for many technological applications including protective coatings, electronic interconnects and microelectromechanical systems (MEMS) devices. However, the large driving force for grain growth caused by the abundance of grain boundaries remains a critical complication in the synthesis and functionality of nanocrystalline materials. Here we present atomistic simulations that illuminate the stabilizing effect of interfacially segregated, oversized dopants in face-centered cubic (fee) copper. Using a bicrystal configuration, the calculated grain boundary energy is reduced to zero with systematically increasing dopant coverage and atomic radius mismatch. We then extend this result to a nanocrystalline network and determine the critical dopant concentration required to eliminate grain growth in bulk and thin film structures. The results of this investigation are intended to guide future experimental efforts to design appropriately doped, stable nanocrystalline materials. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:2329 / 2336
页数:8
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