Multimodal Sensing with a Three-Dimensional Piezoresistive Structure

被引：180

作者：

Won, Sang Min ^{[1
,2
]}

Wang, Heling ^{[4
,5
,6
,7
]}

Kim, Bong Hoon ^{[8
]}

Lee, KunHyuck ^{[6
]}

Jang, Hokyung ^{[2
]}

Kwon, Kyeongha ^{[7
]}

Han, Mengdi ^{[7
]}

Crawford, Kaitlyn E. ^{[9
]}

Li, Haibo ^{[5
,6
,7
]}

Lee, Yechan ^{[2
]}

Yuan, Xuebo ^{[5
,6
,7
]}

Kim, Sung Bong ^{[2
,3
]}

Oh, Yong Suk ^{[7
]}

Jang, Woo Jin ^{[2
]}

Lee, Jong Yoon ^{[2
]}

Han, Seungyong ^{[10
]}

Kim, Jeonghyun ^{[11
]}

Wang, Xueju ^{[12
]}

Xie, Zhaoqian ^{[13
]}

Zhang, Yihui ^{[14
,15
]}

Huang, Yonggang ^{[5
,6
,7
]}

Rogers, John A. ^{[2
,16
,17
,18
,19
,20
,21
,22
]}

机构：

[1] Univ Illinois, Dept Elect & Comp Engn, Urbana, IL 61801 USA

[2] Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

[3] Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA

[4] Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA

[5] Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA

[6] Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA

[7] Northwestern Univ, Ctr Biointegrated Elect, Evanston, IL 60208 USA

[8] Soongsil Univ, Dept Organ Mat & Fiber Engn, Smart Wearable Engn Informat Commun Mat & Converg, 369 Sangdo Ro, Seoul 06978, South Korea

[9] Univ Cent Florida, Dept Mat Sci & Engn, Orlando, FL 32816 USA

[10] Ajou Univ, Dept Mech Engn, Suwon 16499, South Korea

[11] Kwangwoon Univ, Dept Elect Convergence Engn, Seoul 01897, South Korea

[12] Univ Missouri, Dept Mech & Aerosp Engn, Columbia, MO 65201 USA

[13] Dalian Univ Technol, Dept Engn Mech, Dalian 116024, Peoples R China

[14] Tsinghua Univ, Dept Engn Mech, AML, Ctr Flexible Elect Technol, Beijing 100084, Peoples R China

[15] Tsinghua Univ, Dept Engn Mech, AML, Ctr Mech & Mat, Beijing 100084, Peoples R China

[16] Northwestern Univ, McCormick Sch Engn, Simpson Querrey Inst Nano Biotechnol, Ctr Biointegrated Elect,Dept Mat Sci & Engn, Evanston, IL 60208 USA

[17] Northwestern Univ, McCormick Sch Engn, Simpson Querrey Inst Nano Biotechnol, Ctr Biointegrated Elect,Dept Biomed Engn, Evanston, IL 60208 USA

[18] Northwestern Univ, McCormick Sch Engn, Simpson Querrey Inst Nano Biotechnol, Ctr Biointegrated Elect,Dept Chem, Evanston, IL 60208 USA

[19] Northwestern Univ, McCormick Sch Engn, Simpson Querrey Inst Nano Biotechnol, Ctr Biointegrated Elect,Dept Mech Engn, Evanston, IL 60208 USA

[20] Northwestern Univ, McCormick Sch Engn, Simpson Querrey Inst Nano Biotechnol, Ctr Biointegrated Elect,Dept Elect Engn & Comp Sc, Evanston, IL 60208 USA

[21] Northwestern Univ, McCormick Sch Engn, Simpson Querrey Inst Nano Biotechnol, Ctr Biointegrated Elect,Dept Neurol Surg, Evanston, IL 60208 USA

[22] Northwestern Univ, Feinberg Sch Med, Evanston, IL 60208 USA

来源：

ACS NANO | 2019年 / 13卷 / 10期

基金：

新加坡国家研究基金会; 中国国家自然科学基金;

关键词：

tactile sensor; three-dimensional; electronic skin; silicon nanomembrane; electromechanical sensor; STRAIN SENSORS; SKIN;

D O I：

10.1021/acsnano.9b02030

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

Sensors that reproduce the complex characteristics of cutaneous receptors in the skin have important potential in the context of artificial systems for controlled interactions with the physical environment. Multimodal responses with high sensitivity and wide dynamic range are essential for many such applications. This report introduces a simple, three-dimensional type of microelectromechanical sensor that incorporates monocrystalline silicon nanomembranes as piezoresistive elements in a configuration that enables separate, simultaneous measurements of multiple mechanical stimuli, such as normal force, shear force, and bending, along with temperature. The technology provides high sensitivity measurements with millisecond response times, as supported by quantitative simulations. The fabrication and assembly processes allow scalable production of interconnected arrays of such devices with capabilities in spatiotemporal mapping. Integration with wireless data recording and transmission electronics allows operation with standard consumer devices.

引用

页码：10972 / 10979

页数：8

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