Modeling and detecting approach for the change point of electronic product infant failure rate

被引:6
作者
He, Yihai [1 ]
Zhao, Yixiao [1 ]
Wei, Yi [1 ]
Zhang, Anqi [1 ]
Zhou, Di [1 ]
机构
[1] Beihang Univ, Sch Reliabil & Syst Engn, Beijing 100191, Peoples R China
基金
中国国家自然科学基金;
关键词
Infant failure rate; Change point; Statistic index; Weibull shape parameter; CUSUM; WEIBULL SHAPE PARAMETER; CONTROL CHARTS; QUALITY; LIFE;
D O I
10.1016/j.microrel.2019.06.031
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Infant failures are the natural enemy of customer satisfaction of electronic product. The change point is a precondition to optimize the burn-in time, warranty period, and root causes in production reliability assurance. However, the method for modeling and detecting the change point is unavailable due to the deficient research on the mechanism of infant failure, thereby hindering the continuous optimization of reliability in this field. Therefore, a quantitative method for modeling and detecting the change point of infant failure rate by using the Weibull distribution is proposed in this paper. Firstly, the mechanism of infant failure and the connotation of the change point of infant failure rate are explained. Then a statistic index is proposed to quantitatively model the trend of change point with the non-constant Weibull shape parameter. Also, the proposed statistic index is adopted to detect the trend of change point by CUSUM chart. Finally, an analysis example of a control board is presented to verify the effectiveness of the proposed approach in detecting the changing trend of infant failure rate for electronic products.
引用
收藏
页码:222 / 231
页数:10
相关论文
共 17 条
[1]   Thermal behaviors of nanoparticle reinforced epoxy resins for microelectronics packaging [J].
An, Hongzhan ;
Liu, Zhan ;
Tian, Qing ;
Li, Junhui ;
Zhou, Can ;
Liu, Xiaohe ;
Zhu, Wenhui .
MICROELECTRONICS RELIABILITY, 2019, 93 :39-44
[2]   Monitoring the Weibull Shape Parameter with Type II Censored Data [J].
Chan, Yin ;
Han, Bing ;
Pascual, Francis .
QUALITY AND RELIABILITY ENGINEERING INTERNATIONAL, 2015, 31 (05) :741-760
[3]   CUSUM Charts for Monitoring the Characteristic Life of Censored Weibull Lifetimes [J].
Dickinson, Rebecca M. ;
Roberts, Denisa A. Olteanu ;
Driscoll, Anne R. ;
Woodall, William H. ;
Vining, G. Geoffrey .
JOURNAL OF QUALITY TECHNOLOGY, 2014, 46 (04) :340-358
[4]   Lifetime-aware scheduling in high level synthesis [J].
Es'haghi, Siavash ;
Eshghi, Mohammad .
MICROELECTRONICS RELIABILITY, 2018, 91 :86-97
[5]   Control Charts For Monitoring The Weibull Shape Parameter Based On Type-II Censored Sample [J].
Guo, Baocai ;
Wang, Bing Xing .
QUALITY AND RELIABILITY ENGINEERING INTERNATIONAL, 2014, 30 (01) :13-24
[6]   A fuzzy TOPSIS and Rough Set based approach for mechanism analysis of product infant failure [J].
He, Yi-Hai ;
Wang, Lin-Bo ;
He, Zhen-Zhen ;
Xie, Min .
ENGINEERING APPLICATIONS OF ARTIFICIAL INTELLIGENCE, 2016, 47 :25-37
[7]   Integrated predictive maintenance strategy for manufacturing systems by combining quality control and mission reliability analysis [J].
He, Yihai ;
Gu, Changchao ;
Chen, Zhaoxiang ;
Han, Xiao .
INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH, 2017, 55 (19) :5841-5862
[8]   Modelling infant failure rate of electromechanical products with multilayered quality variations from manufacturing process [J].
He, Yihai ;
Wang, Linbo ;
He, Zhenzhen ;
Xiao, Xun .
INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH, 2016, 54 (21) :6594-6612
[9]   Product Reliability Oriented Design Scheme of Control Chart Based on the Convergent CEV for Censored Characteristics [J].
He, Yihai ;
Wang, Linbo ;
He, Zhenzhen ;
Wei, Yi .
MATHEMATICAL PROBLEMS IN ENGINEERING, 2015, 2015
[10]   Reliability Modeling of Accelerated Life Tests with Both Random Effects and Nonconstant Shape Parameters [J].
Lv, Shanshan ;
Niu, Zhanwen ;
Qu, Liang ;
He, Shuguang ;
He, Zhen .
QUALITY ENGINEERING, 2015, 27 (03) :329-340