Diffusion of implanted nitrogen in the Cu(001) surface

被引:2
|
作者
Cristina, Lucila [1 ,2 ]
Gomez, Liliana [3 ]
Vidal, Ricardo [1 ,2 ]
Ferron, Julio [1 ,2 ,4 ]
机构
[1] Univ Nacl Litoral, Inst Desarrollo Tecnol Ind Quim INTEC, RA-3000 Santa Fe, Argentina
[2] Univ Nacl Litoral, CONICET, RA-3000 Santa Fe, Argentina
[3] Fac Ciencias Exactas Ingn & Agrimensura, Inst Fis Rosario, RA-2000 Rosario, Santa Fe, Argentina
[4] Univ Nacl Litoral, Dept Mat, Fac Ingn Quim, RA-3000 Santa Fe, Argentina
关键词
NITRIDE THIN-FILMS; COPPER NITRIDE; DEPOSITION; CU3N; ADSORPTION; XPS;
D O I
10.1088/0022-3727/43/18/185302
中图分类号
O59 [应用物理学];
学科分类号
摘要
Auger electron spectroscopy (AES) was used to study the thermally activated diffusion process of low energy N(+) implanted on the Cu(0 0 1) surface, a proposed model system for self-assembled nanostructures. The nitrogen diffusion was characterized as a function of the substrate temperature and the N(+) implantation energy. An experiment that combines a temperature evolution followed by an AES depth profiling was done to clarify the type of diffusion. A comparison of the experimental results with kinetic Monte Carlo simulations suggests a preferential diffusion of the nitrogen to the surface followed by nitride decomposition.
引用
收藏
页数:6
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