Study on thermal performance of high power LED employing aluminum filled epoxy composite as thermal interface material

This paper elucidates the thermal behavior of an LED employing metal filled polymer matrix as thermal interface material (TIM) for an enhanced heat dissipation characteristic. Highly thermal conductive aluminum (Al) particles were incorporated in bisphenol A diglycidylether (DGEBA) epoxy matrix to study the effect of filler to polymer ratio on the thermal performance of high power LEDs. The curing behavior of DGEBA was studied by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The dispersion nature of the Al fillers in polymer matrix was verified with Field Emission Scanning Electron Microscope (FESEM). The thermal performance of synthesized Al filled polymer composite as TIM was tested with an LED employing thermal transient measurement technique. Comparing the filler to polymer ratio, the rise in junction temperature for 60 wt% Al filled composite was higher by 11.1 degrees C than 50 wt% Al filled composite at cured state. Observed also from the structure function analysis that the total thermal resistance was 10.96 K/W higher for 60 wt% Al filled composite compared to 50 wt% Al filled composite. On the other hand, a significant rise of 9.5 degrees C in the junction temperature between cured and uncured samples of 50 wt% Al filled polymer TIM was observed and hence the importance of curing process of metal filled polymer composite for effective heat dissipation is discussed extensively in this work. (C) 2014 Elsevier Ltd. All rights reserved.