Optimal heatsink design for a solid-state relay using a 3D modeling and simulation software

An important power electronic device within automation power systems is the solid-state relay. In many cases, catastrophic failure is a result of steep temperature gradient in the localized temperature distribution. Hence, an optimal heatsink design for certain industrial applications has become a real necessity. In this paper, the Pro/ENGINEER software with the thermal simulation integrated tool, Pro/MECHANICA, has been used. Starting on initial heatsink dimensions, It has been modified the base plate thickness, length and fin dimensions in order to get a maximum thermal transfer from the triac chip to the environment. Finally, it was obtained a heatsink with new dimensions that allow a better cooling for the triac mounted on it. The experimental tests have confirmed the simulation results. Therefore, the usage of the specific 3D modeling and simulation software allow to design special heatsinks to make a better cooling of the power electronic components at given operating conditions.