Constant current stress-induced leakage current in mixed HfO2-Ta2O5 stacks

被引:10
作者
Atanassova, E. [1 ]
Novkovski, N. [2 ]
Paskaleva, A. [1 ]
Spassov, D. [1 ]
机构
[1] Bulgarian Acad Sci, Inst Solid State Phys, Sofia 1784, Bulgaria
[2] Fac Nat Sci & Math, Inst Phys, Skopje 1000, North Macedonia
关键词
HIGH-K DIELECTRICS; ELECTRICAL-PROPERTIES; GATE DIELECTRICS; RELIABILITY; TA2O5; MECHANISMS; CHALLENGES; GENERATION; DEPENDENCE; CHARGE;
D O I
10.1016/j.microrel.2010.01.005
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The electrical characteristics of HfO2-Ta2O5 mixed stacks under constant current stress (CCS) at gate injection with 20 mA/cm(2) and stressing times of 50 and 200 s have been investigated A very weak effect of the stress on the global dielectric constant. on fast and slow states in the stack as well as on the dominant conduction mechanism is detected. The most sensitive parameter to the CCS is the leakage current The stress-induced leakage current (SILC) is voltage and thickness dependent The pre-existing traps govern the trapping kinetics and are a key parameter to evaluate the stress response Two processes - positive charge build-up and new bulk traps generation - are suggested to be responsible for SILC. the domination of one of them depends on both the film thickness and the stressing time The positive charge build-up is localized close to the gate electrode implying gate-induced defects could be precursors for it. It is established that unlike the case of single SiO2 layer, the bulk traps closer to the gate electrode control SILC in the mixed Ta2O5-HfO2-based capacitors (C) 2010 Elsevier Ltd. All rights reserved.
引用
收藏
页码:794 / 800
页数:7
相关论文
共 39 条
[1]   Band alignment at the interface of (100)Si with HfxTa1-xOy high-κ dielectric layers -: art. no. 072108 [J].
Afanas'ev, VV ;
Stesmans, A ;
Zhao, C ;
Caymax, M ;
Rittersma, ZM ;
Maes, JW .
APPLIED PHYSICS LETTERS, 2005, 86 (07) :1-3
[2]  
ARANASSOVA E, 2010, MICROELECTR IN PRESS, DOI DOI 10.1016/J.MEE.2009.09.005
[3]   Electrical characteristics of Ti-doped Ta2O5 stacked capacitors [J].
Atanassova, E. ;
Spassov, D. ;
Paskaleva, A. ;
Georgieva, M. ;
Kopninarova, J. .
THIN SOLID FILMS, 2008, 516 (23) :8684-8692
[4]   Effects of the metal gate on the stress-induced traps in Ta2O5/SiO2 stacks [J].
Atanassova, E. ;
Paskaleva, A. ;
Novkovski, N. .
MICROELECTRONICS RELIABILITY, 2008, 48 (04) :514-525
[5]   Challenges of Ta2O5 as high-k dielectric for nanoscale DRAMs [J].
Atanassova, E. ;
Paskaleva, A. .
MICROELECTRONICS RELIABILITY, 2007, 47 (06) :913-923
[6]   Thin RF sputtered and thermal Ta2O5 on Si for high density DRAM application [J].
Atanassova, E .
MICROELECTRONICS RELIABILITY, 1999, 39 (08) :1185-1217
[7]  
ATANASSOVA E, 2006, NEW MAT PROCESSES IN, P77
[8]  
ATANASSOVA E, 2008, RECENT PAT ELECT ENG, V1, P47
[9]  
ATANASSOVA E, 2008, SEMICOND SCI TECH, V23
[10]   A model for multistep trap-assisted tunneling in thin high-k dielectrics -: art. no. 044107 [J].
Blank, O ;
Reisinger, H ;
Stengl, R ;
Gutsche, M ;
Wiest, F ;
Capodieci, V ;
Schulze, J ;
Eisele, I .
JOURNAL OF APPLIED PHYSICS, 2005, 97 (04)