RLC effects in fine pitch anisotropic conductive film connections

被引:1
作者
Dou, GB [1 ]
Chan, YC [1 ]
Morris, JE [1 ]
Yeung, NH [1 ]
机构
[1] CUNY, Dept Elect Engn, Kowloon, Hong Kong, Peoples R China
来源
53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS | 2003年
关键词
D O I
10.1109/ECTC.2003.1216504
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Resistance, capacitance and inductance of Anisotropic Conductive Films (ACFs) connections determine their high frequency electrical characteristics. The presence of capacitance and inductance in the ACF joint contributes time delay and crosstalk noise as well as simultaneous switching noise (SSN) into the circuit system. Experiments on the transient response of the ACF joint and proposed ACF model were made in order to quantify the amounts of the capacitance (C) and inductance (L) of the ACF connection. Tektronix TDS 3014 Digital Oscilloscope was introduced to measure the transient response, which is typical RLC instant response in the range of ns. PCB board was designed to amplify current signals. An ACF connection equivalent model that consists of resistors, inductor, and capacitor between the planes was adopted from its physical entity. To work out the C and the L from the responses, Kirchhoff's Voltage Law was applied. In conclusion, R, L, and C can be calculated from the equation of RLC transient response, also this paper will explain the RLC effects on the high frequency electrical characteristics of the ACF connection.
引用
收藏
页码:1559 / 1564
页数:6
相关论文
共 50 条
  • [41] Ultra-fine pitch chip-on-glass (COG) bonding with metal bumps having insulating layer in the side walls using anisotropic conductive film (ACF)
    Hong, Myung Hwan
    Kim, Sun-Chul
    Kim, Young-Ho
    [J]. CURRENT APPLIED PHYSICS, 2012, 12 (03) : 612 - 615
  • [42] Random dispersion effects of conductive particles on anisotropic conductive film's (ACF's) bonding yield
    Lin, Chao-Ming
    Chi, Mao-Chieh
    Liu, Yen-Chun
    [J]. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2018, 24 (01): : 49 - 53
  • [43] Enhancement of electrical stability of anisotropic conductive film (ACF) interconnections with viscosity-controlled and high Tg ACFs in fine-pitch chip-on-glass applications
    Chung, Chang-Kyu
    Kim, Jae-Han
    Lee, Jong-Won
    Seo, Kyoung-Won
    Paik, Kyung-Wook
    [J]. MICROELECTRONICS RELIABILITY, 2012, 52 (01) : 217 - 224
  • [44] Random dispersion effects of conductive particles on anisotropic conductive film’s (ACF’s) bonding yield
    Chao-Ming Lin
    Mao-Chieh Chi
    Yen-Chun Liu
    [J]. Microsystem Technologies, 2018, 24 : 49 - 53
  • [45] A STUDY ON THE NOVEL ANCHORING POLYMER LAYER(APL) ANISOTROPIC CONDUCTIVE FILMS(ACFs) FOR ULTRA FINE PITCH ASSEMBLY APPLICATIONS
    Paik, Kyung-Wook
    Yoon, Dal-Jin
    [J]. 2018 PAN PACIFIC MICROELECTRONICS SYMPOSIUM (PAN PACIFIC), 2018,
  • [46] High Power and Fine Pitch Assembly Using Solder Anisotropic Conductive Films (ACFs) Combined with Ultrasonic Bonding Technique
    Lee, Kiwon
    Paik, Kyung Wook
    [J]. 2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 421 - 426
  • [47] Effects of systematic and stochastic errors on estimated failure probability of anisotropic conductive film
    Lin, Chao-Ming
    [J]. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2007, 7 (03) : 387 - 398
  • [48] A Study on the Conductive Particle Movements in Polyvinylidene Fluoride Anchoring Polymer Layer Anisotropic Conductive Films for 20-μm Fine-Pitch Interconnection
    Lee, Sang-Hoon
    Yoon, Dal-Jin
    Paik, Kyung-Wook
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 9 (02): : 209 - 215
  • [49] Microwave curing of anisotropic conductive film: Effects of principal parameters on curing situation
    Chan, KK
    Yeung, NH
    Chan, YC
    Tan, SC
    Lee, KK
    [J]. 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 1701 - 1704
  • [50] Analysis of new anisotropic conductive film (ACF)
    Lin, CM
    Chang, WJ
    Fang, TH
    [J]. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2005, 5 (04) : 694 - 700