RLC effects in fine pitch anisotropic conductive film connections

被引:1
|
作者
Dou, GB [1 ]
Chan, YC [1 ]
Morris, JE [1 ]
Yeung, NH [1 ]
机构
[1] CUNY, Dept Elect Engn, Kowloon, Hong Kong, Peoples R China
来源
53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS | 2003年
关键词
D O I
10.1109/ECTC.2003.1216504
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Resistance, capacitance and inductance of Anisotropic Conductive Films (ACFs) connections determine their high frequency electrical characteristics. The presence of capacitance and inductance in the ACF joint contributes time delay and crosstalk noise as well as simultaneous switching noise (SSN) into the circuit system. Experiments on the transient response of the ACF joint and proposed ACF model were made in order to quantify the amounts of the capacitance (C) and inductance (L) of the ACF connection. Tektronix TDS 3014 Digital Oscilloscope was introduced to measure the transient response, which is typical RLC instant response in the range of ns. PCB board was designed to amplify current signals. An ACF connection equivalent model that consists of resistors, inductor, and capacitor between the planes was adopted from its physical entity. To work out the C and the L from the responses, Kirchhoff's Voltage Law was applied. In conclusion, R, L, and C can be calculated from the equation of RLC transient response, also this paper will explain the RLC effects on the high frequency electrical characteristics of the ACF connection.
引用
收藏
页码:1559 / 1564
页数:6
相关论文
共 50 条
  • [21] Novel Nanofiber Anisotropic Conductive Films (ACFs) with coupled conductive particles for Ultra Fine Pitch Electronic Packaging Applications
    Paik, Kyung-Wook
    Suk, Kyoung-Lim
    NANOTECHNOLOGY 2011: ELECTRONICS, DEVICES, FABRICATION, MEMS, FLUIDICS AND COMPUTATIONAL, NSTI-NANOTECH 2011, VOL 2, 2011, : 418 - +
  • [22] Plasma-etched Nanofiber Anisotropic Conductive Films (ACFs) for Ultra Fine Pitch Interconnection
    Lee, Sang Hoon
    Kim, Tae Wan
    Paik, Kyung-Wook
    2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 142 - 145
  • [23] FABRIC-BASED FINE PITCH INTERCONNECT TECHNOLOGY USING ANISOTROPIC CONDUCTIVE FILMS (ACFs)
    Paik, Kyung W.
    2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D), 2017, : 16 - 16
  • [24] FABRIC-BASED FINE PITCH INTERCONNECT TECHNOLOGY USING ANISOTROPIC CONDUCTIVE FILMS(ACFs)
    Paik, Kyung W.
    2017 PAN PACIFIC MICROELECTRONICS SYMPOSIUM (PAN PACIFIC), 2017,
  • [25] Flux Function added Solder Anisotropic Conductive Films (ACFs) for High Power and Fine Pitch Assemblies
    Kim, Seung-Ho
    Choi, Yongwon
    Kim, Yoosun
    Paik, Kyung-Wook
    2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 1713 - 1716
  • [26] Anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) applications
    Yim, MJ
    Hwang, J
    Paik, KW
    2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005, : 181 - 186
  • [27] A Study on Nanofiber Anisotropic Conductive Films (ACFs) for Fine Pitch Chip-on-Glass (COG) Interconnections
    Lee, Sang Hoon
    Kim, Tae Wan
    Paik, Kyung-Wook
    2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1060 - 1063
  • [28] Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications
    Yim, Myung Jin
    Hwang, Jinsang
    Paik, Kyung Wook
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2007, 27 (01) : 77 - 84
  • [29] Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects
    Chiu, YW
    Chan, YC
    Lui, SM
    MICROELECTRONICS RELIABILITY, 2002, 42 (12) : 1945 - 1951
  • [30] Capillary Self-Assembly Register Microspheres to Fabricate Anisotropic Conductive Film Used for Ultra-Fine Pitch Stable Electrical Interfacing Interconnection
    Pan, Rui
    Zhang, Wei
    Cheng, Hua
    Yang, Jihua
    Gong, Yi
    Hu, Rui
    Zhuo, Yizhi
    Ding, Jianjun
    Zhang, Xian
    Chen, Lin
    Tian, Xingyou
    ADVANCED MATERIALS TECHNOLOGIES, 2023, 8 (18)