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- [4] Recent development of anisotropic conductive film for fine pitch COF connection 2008 SID INTERNATIONAL SYMPOSIUM, DIGEST OF TECHNICAL PAPERS, VOL XXXIX, BOOKS I-III, 2008, 39 : 1442 - 1445
- [6] Fine pitch bonding technology for chip-to-chip adopted anisotropic conductive film 1ST 1997 IEMT/IMC SYMPOSIUM, 1997, : 51 - 55
- [7] ELECTRIC PROPERTIES OF CONNECTIONS BY ANISOTROPIC CONDUCTIVE FILM JOURNAL OF ELECTRONICS MANUFACTURING, 1995, 5 (01): : 33 - 37
- [8] Design of nanowire anisotropic conductive film for ultra-fine pitch flip chip interconnection 6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 120 - 125
- [9] Fabrication of nanowire anisotropic conductive film for ultra-fine pitch flip chip interconnection 55TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2005 PROCEEDINGS, 2005, : 66 - 70
- [10] Development of 0.025 mm pitch anisotropic conductive film International Journal of Microcircuits and Electronic Packaging, 22 (01): : 38 - 42