RLC effects in fine pitch anisotropic conductive film connections

被引:1
|
作者
Dou, GB [1 ]
Chan, YC [1 ]
Morris, JE [1 ]
Yeung, NH [1 ]
机构
[1] CUNY, Dept Elect Engn, Kowloon, Hong Kong, Peoples R China
来源
53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS | 2003年
关键词
D O I
10.1109/ECTC.2003.1216504
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Resistance, capacitance and inductance of Anisotropic Conductive Films (ACFs) connections determine their high frequency electrical characteristics. The presence of capacitance and inductance in the ACF joint contributes time delay and crosstalk noise as well as simultaneous switching noise (SSN) into the circuit system. Experiments on the transient response of the ACF joint and proposed ACF model were made in order to quantify the amounts of the capacitance (C) and inductance (L) of the ACF connection. Tektronix TDS 3014 Digital Oscilloscope was introduced to measure the transient response, which is typical RLC instant response in the range of ns. PCB board was designed to amplify current signals. An ACF connection equivalent model that consists of resistors, inductor, and capacitor between the planes was adopted from its physical entity. To work out the C and the L from the responses, Kirchhoff's Voltage Law was applied. In conclusion, R, L, and C can be calculated from the equation of RLC transient response, also this paper will explain the RLC effects on the high frequency electrical characteristics of the ACF connection.
引用
收藏
页码:1559 / 1564
页数:6
相关论文
共 50 条
  • [1] RLC effects in fine pitch anisotropic conductive film connections
    Dou, G
    Chan, YC
    Morris, JE
    Whalley, DC
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2006, 18 (01) : 3 - 10
  • [2] Anisotropic Conductive Film Interconnects for Fine-pitch MEMS
    Hoang-Vu Nguyen
    Kristiansen, Helge
    Larsson, Andreas
    Poppe, Erik
    Johannessen, Rolf
    Hoivik, Nils
    Aasmundtveit, Knut E.
    2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2012,
  • [3] Ultra Fine Pitch Anisotropic Conductive Film with Fixed Array of Conductive Particles
    Liang, Rong-Chang
    Morita, Yasumasa
    Tseng, Scott
    Rokutanda, Shuji
    Chung, Jerry
    McNamara, John
    Wu, Zarng-Arh George
    IDW'10: PROCEEDINGS OF THE 17TH INTERNATIONAL DISPLAY WORKSHOPS, VOLS 1-3, 2010, : 1909 - 1912
  • [4] Recent development of anisotropic conductive film for fine pitch COF connection
    Ishimatsu, Tomoyuki
    Kojima, Ryoji
    2008 SID INTERNATIONAL SYMPOSIUM, DIGEST OF TECHNICAL PAPERS, VOL XXXIX, BOOKS I-III, 2008, 39 : 1442 - 1445
  • [5] Reliability analysis of the fine pitch connection using anisotropic conductive film (ACF)
    Lin, CM
    Chang, WJ
    Fang, TH
    MICROELECTRONICS JOURNAL, 2006, 37 (07) : 565 - 568
  • [6] Fine pitch bonding technology for chip-to-chip adopted anisotropic conductive film
    Ozawa, S
    Kitayama, Y
    Takahashi, W
    Tohyama, H
    Yamashita, T
    1ST 1997 IEMT/IMC SYMPOSIUM, 1997, : 51 - 55
  • [7] ELECTRIC PROPERTIES OF CONNECTIONS BY ANISOTROPIC CONDUCTIVE FILM
    SHIOZAWA, N
    ISAKA, K
    OHTA, T
    JOURNAL OF ELECTRONICS MANUFACTURING, 1995, 5 (01): : 33 - 37
  • [8] Design of nanowire anisotropic conductive film for ultra-fine pitch flip chip interconnection
    Lin, RJ
    Hsu, YY
    Fan, RC
    Chen, YC
    Cheng, SY
    Huang, CT
    Uang, RH
    6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 120 - 125
  • [9] Fabrication of nanowire anisotropic conductive film for ultra-fine pitch flip chip interconnection
    Lin, RJ
    Hsu, YY
    Chen, YC
    Cheng, SY
    Uang, RH
    55TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2005 PROCEEDINGS, 2005, : 66 - 70
  • [10] Development of 0.025 mm pitch anisotropic conductive film
    Eriguchi, Fuyuki
    Maeda, Masako
    Asai, Fumiteru
    Hotta, Yuji
    International Journal of Microcircuits and Electronic Packaging, 22 (01): : 38 - 42