Effect of rising and failing K profiles on SCC growth rates in high-temperature water

被引:23
作者
Andresen, Peter L. [1 ]
Morra, Martin M. [1 ]
机构
[1] GE Global Res, Schenectady, NY 12309 USA
来源
JOURNAL OF PRESSURE VESSEL TECHNOLOGY-TRANSACTIONS OF THE ASME | 2007年 / 129卷 / 03期
关键词
D O I
10.1115/1.2748830
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Effects of rising and falling stress intensity factor (K) profiles on the stress corrosion cracking (SCC) growth rates of stainless steel and nickel alloys has been studied in high-temperature water Sophisticated test control software was used that changes loading (P) based on crack length (a) to achieve a specific K trajectory by controlling dK/da, not simply dP/dt. The majority of SCC problems develop adjacent to welds, which have a complex residual stress profile versus wall thickness. This, coupled with the dependence of K on crack length, causes K to change as the crack grows, not per se with time (t). The effect of the rate of change in K on crack tip strain rate and the associated crack growth rate is discussed, along with the repercussions to understanding and dispositioning SCC response.
引用
收藏
页码:488 / 506
页数:19
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