Compressive stress effects on nanoparticle modulus and fracture

被引：101

作者：

Mook, W. M. ^{[1
]}

Nowak, J. D. ^{[1
]}

Perrey, C. R. ^{[1
]}

Carter, C. B. ^{[1
]}

Mukherjee, R. ^{[1
]}

Girshick, S. L. ^{[1
]}

McMurry, P. H. ^{[1
]}

Gerberich, W. W. ^{[1
]}

机构：

[1] Univ Minnesota, Minneapolis, MN 55455 USA

来源：

PHYSICAL REVIEW B | 2007年 / 75卷 / 21期

关键词：

D O I：

10.1103/PhysRevB.75.214112

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Individual nanoparticles of silicon and titanium having diameters in the range of 40-140 nm have been repeatedly compressed by a nanoindenter. Even at low loads, the small tip-particle and particle-substrate contacts generate extreme pressures within the confined particle, influencing its stiffness and fracture toughness. The effect of these high pressures on the measured modulus is taken into account by invoking a Murnaghan equation-of-state-based analysis. Fracture toughness of the silicon particles is found to increase by a factor of 4 in compression for a 40-nm-diam particle when compared to bulk silicon. Additionally, strain energy release rates increase by more than an order of magnitude for particles of this size when compared to bulk Si.

引用

页数：10

共 28 条

[1] Nanoindentation of silicon surfaces: Molecular-dynamics simulations of atomic force microscopy [J].