Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag-Sn, Cu-Sn and Ni-Sn intermetallic compounds

被引：80

作者：

Flandorfer, H.

Saeed, U.

Luef, C.

Sabbar, A.

Ipser, H.

机构：

[1] Univ Vienna, Inst Inorgan Chem Mat Chem, A-1090 Vienna, Austria

[2] Univ Mohammed 5, Fac Sci, Lab Chim Phys Gen, Rabat, Morocco

来源：

THERMOCHIMICA ACTA | 2007年 / 459卷 / 1-2期

基金：

奥地利科学基金会;

关键词：

calorimetry; enthalpy of formation; lead-free solder alloy; intermetallic compounds;

D O I：

10.1016/j.tca.2007.04.004

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Standard enthalpies of formation were determined for a number of binary intermetallic compounds in the systems Ag-Sn, Cu-Sn, and Ni-Sn by means of solution calorimetry in liquid Sn in a Calvet-type microcalori meter. For the pure elements Ag, Cu, and Ni, the limiting partial enthalpies of mixing as well as the enthalpies of solution at infinite dilution in Sn were measured at 773, 873, 973 and 1073 K. The results for the enthalpy of formation for the intermetallic compounds Ag3Sn, Ag4Sn, Cu3Sn, Cu41Sn11, Cu6Sn5, Ni3Sn-LT, Ni3Sn2-HT, and Ni3Sn4 are discussed and compared with the corresponding literature values. (c) 2007 Elsevier B.V. All rights reserved.

引用

页码：34 / 39

页数：6

共 20 条

[1] On the heat of formation of intermetallic compounds V Cobalt-aluminium alloys, copper alloys [J].