A thermal stability study of alkane and aromatic thiolate self-assembled monolayers on copper surfaces

被引:36
作者
Carbonell, L
Whelan, CM
Kinsella, M
Maex, K
机构
[1] IMEC VZW, B-3001 Louvain, Belgium
[2] Katholieke Univ Leuven, EE Dept, B-3001 Louvain, Belgium
关键词
D O I
10.1016/j.spmi.2004.08.033
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
The thermal stability of 1-decanethiol (C10) and benzenethiol (BT) Self-Assembled Monolayers (SAMs) on metallic and oxidized copper surfaces has been investigated by thermal desorption spectrometry. High quality C10 and BT SAMs exhibit low thermal stabilities on clean copper surfaces with a maximum in decomposition occurring between 100 and 150 degreesC. The decomposition of SAMs follows different mechanisms. For the alkanethiol, a direct interaction between the alkyl group of the thiolate and the metallic copper surface is the dominant pathway for the C-S bond scission. The head group desorbs as oxidized sulfur and this is followed by the desorption of the alkyl fragments of the chain adsorbed on the clean copper surface. In the case of benzenethiol, a simultaneous desorption of the head group as oxidized sulfur and the benzene group occurs. SAM formation on the oxidized copper surface results in complete removal and/or reduction of the CuO layer. Higher SAM surface coverages on the resulting CU/CU2O surface result from the enhanced surface roughness of the substrate. The decomposition mechanisms and thermal stabilities of the C10 and BT SAMs are dependent on the oxidation state of the underlying substrate and the chemical nature of the chain. (C) 2004 Elsevier Ltd. All rights reserved.
引用
收藏
页码:149 / 160
页数:12
相关论文
共 20 条
[1]   Grain growth, stress, and impurities in electroplated copper [J].
Brongersma, SH ;
Kerr, E ;
Vervoort, I ;
Saerens, A ;
Maex, K .
JOURNAL OF MATERIALS RESEARCH, 2002, 17 (03) :582-589
[2]   Dry oxidation mechanisms of copper in trenches [J].
Carbonell, L ;
Ratchev, P ;
Caluwaerts, R ;
Van Hove, M ;
Verlinden, B ;
Maex, K .
MICROELECTRONIC ENGINEERING, 2002, 64 (1-4) :63-71
[3]  
Ellis TW, 2000, SOLID STATE TECHNOL, V43, P71
[4]  
LAFFINEUR F, 2002, Z MEKHALIF COLLOID A, V817, P817
[5]   Thermal reaction of trimethylphosphine and triethylphosphine on Cu(110) [J].
Lai, YH ;
Yeh, CT ;
Lin, HJ ;
Chen, CT ;
Hung, WH .
JOURNAL OF PHYSICAL CHEMISTRY B, 2002, 106 (07) :1722-1727
[6]   Adsorption and thermal decomposition of alkanethiols on Cu(110) [J].
Lai, YH ;
Yeh, CT ;
Cheng, SH ;
Liao, P ;
Hung, WH .
JOURNAL OF PHYSICAL CHEMISTRY B, 2002, 106 (21) :5438-5446
[7]   OMEGA-TERMINATED ALKANETHIOLATE MONOLAYERS ON SURFACES OF COPPER, SILVER, AND GOLD HAVE SIMILAR WETTABILITIES [J].
LAIBINIS, PE ;
WHITESIDES, GM .
JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 1992, 114 (06) :1990-1995
[8]   SELF-ASSEMBLED MONOLAYERS OF N-ALKANETHIOLATES ON COPPER ARE BARRIER FILMS THAT PROTECT THE METAL AGAINST OXIDATION BY AIR [J].
LAIBINIS, PE ;
WHITESIDES, GM .
JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 1992, 114 (23) :9022-9028
[9]   Gaseous impurities in Co silicidation - Impact and solutions [J].
Li, H ;
Vereecke, G ;
Maex, K ;
Froyen, L .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2001, 148 (06) :G344-G354
[10]   OXIDATION AND PROTECTION IN COPPER AND COPPER ALLOY THIN-FILMS [J].
LI, J ;
MAYER, JW ;
COLGAN, EG .
JOURNAL OF APPLIED PHYSICS, 1991, 70 (05) :2820-2827