共 50 条
- [32] Fluxless flip-chip for multichip modules 1996 IEEE MULTI-CHIP MODULE CONFERENCE, PROCEEDINGS, 1996, : 39 - 43
- [35] Modeling the Flip-Chip Wetting Process IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2014, 4 (12): : 2004 - 2017
- [36] Nanocomposite underfills for flip-chip applications 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 951 - 956
- [37] Encapsulant materials for flip-chip attach 48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 1291 - 1297
- [38] Flip-chip packaging for smart MEMS SMART STRUCTURES AND MATERIALS 1998: SMART ELECTRONICS AND MEMS, 1998, 3328 : 183 - 193
- [39] Processing mechanics for flip-chip assembly MICROELECTRONIC PACKAGING AND LASER PROCESSING, 1997, 3184 : 22 - 29