Organic flip-chip tackles communications

被引：0
|
作者：
Chin, S
机构：
来源：
ELECTRONIC PRODUCTS MAGAZINE | 2000年 / 43卷 / 05期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：23 / 23
页数：1
相关论文
共 50 条
  • [1] Adhesion issues in flip-chip on organic modules
    Tran, SK
    Questad, DL
    Sammakia, BG
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 1999, 22 (04): : 519 - 524
  • [2] Flip-chip on organic carrier assembly evaluation
    Banks, DR
    Bahe, SM
    Holcomb, MD
    Le-Huu, DK
    PAN PACIFIC MICROELECTRONICS SYMPOSIUM, 2001, PROCEEDINGS, 2001, : 230 - 234
  • [3] Adhesion issues in flip-chip on organic modules
    Tran, SK
    Questad, DL
    Sammakia, BG
    ITHERM '98: SIXTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 1998, : 263 - 268
  • [4] Flip-chip photodetector for high-speed communications instrumentation
    Tan, TS
    Kocot, CP
    Braun, DM
    Sloan, SR
    Bagwell, TL
    Straznicky, J
    HEWLETT-PACKARD JOURNAL, 1997, 48 (05): : 102 - 110
  • [5] Materials and mechanics issues in flip-chip organic packaging
    Wu, TY
    Tsukada, Y
    Chen, WT
    46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS, 1996, : 524 - 534
  • [6] LOW EXPANSIVITY ORGANIC SUBSTRATE FOR FLIP-CHIP BONDING
    GREER, SE
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1979, 2 (01): : 140 - 144
  • [7] Thermally enhanced flip-chip BGA with organic substrate
    Matsushima, H
    Baba, S
    Tomita, Y
    Watanabe, M
    Hayashi, E
    Takemoto, Y
    48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 685 - 691
  • [8] Materials and mechanics issues in flip-chip organic packaging
    IBM Microelectronics Div, Endicott, United States
    Proc Electron Compon Technol Conf, (524-534):
  • [9] FLIP-CHIP ASSEMBLY
    HUGLE, WB
    BAMBERG, JL
    PEDROTTI, DG
    SOLID STATE TECHNOLOGY, 1969, 12 (08) : 62 - &
  • [10] Reliability evaluation of underfill in flip-chip organic BGA packages
    Banks, DR
    Pofahl, RG
    Sylvester, MF
    1997 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 1997, 3235 : 124 - 125
12345