Effect of temperature on elastic properties of woven-glass epoxy composites for printed circuit board applications

被引：25

作者：

Hutapea, P ^{[1
]}

Grenestedt, JL ^{[1
]}

机构：

[1] Lehigh Univ, Dept Mech Engn & Mech, Bethlehem, PA 18015 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2003年 / 32卷 / 04期

关键词：

temperature effect on elastic properties; woven-glass epoxy substrates; printed circuit boards; vibration method; Young's moduli; in-plane shear moduli; out-of-plane shear moduli;

D O I：

10.1007/s11664-003-0213-0

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The effect of temperature on the elastic properties of woven-glass epoxy substrates for printed circuit board applications was investigated. Three common commercially pressed boards (1080, 2116, and 7628 woven-glass fabrics and FR4 epoxy) were used for this study. The elastic properties were identified by means of a combined theoretical and experimental vibration method. Vibration experiments were performed under reduced air pressure to reduce the influence of mass, stiffness, and damping of the surrounding air and inside an environmental chamber with varying temperature and constant humidity. Above the glass-transition temperature (Tg) of the epoxy, the in-plane shear moduli (G(12)) were decreased by 33-37% and the out-of-plane shear moduli (G(13), G(23)) were decreased by 48%, whereas the Young's moduli in the warp (E-1) and fill (E-2) directions were much less affected.

引用

页码：221 / 227

页数：7

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