Impact of Package Inductance on Stability of mm-Wave Power Amplifiers

被引：0
|
作者：
Jeon, Yong-Joon [1 ]
Kumarasamy, Raja Muthusamy [1 ]
机构：
[1] ASTAR, Inst Microelect, Singapore, Singapore
来源：
2020 IEEE 22ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) | 2020年
关键词：
D O I：
10.1109/EPTC50525.2020.9315069
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
It is known that mm-Wave power amplifiers can suffer from deterioration of power gain and efficiency due to package parasitic. This paper addresses specifically the impact of package inductances on the stability. Two methods are suggested to improve the stability, which are adoption of wide-band RC networks and splitting power supplies and grounds for multi-stage amplifiers.
引用
收藏
页码：255 / 256
页数：2
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