Analysis of Power Supply And Signal Integrity of High Speed PCB Board

被引：0

作者：

Liu, Jin ^{[1
]}

Zhang, Min ^{[2
]}

Hu, Gang ^{[1
]}

机构：

[1] Wuhan Maritime Commun Res Inst, Wuhan, Hubei, Peoples R China

[2] Hubei Univ Technol, Sch Mech Engn, Wuhan, Hubei, Peoples R China

来源：

PROCEEDINGS OF 2019 IEEE 8TH JOINT INTERNATIONAL INFORMATION TECHNOLOGY AND ARTIFICIAL INTELLIGENCE CONFERENCE (ITAIC 2019) | 2019年

关键词：

high speed circuit; power integrity; signal integrity;

D O I：

10.1109/itaic.2019.8785842

中图分类号：

TP18 [人工智能理论];

学科分类号：

081104 ; 0812 ; 0835 ; 1405 ;

摘要：

High-speed circuit boards are an inevitable trend in the development of electronic systems at this stage. Signal integrity and power integrity issues caused by high-speed and high-density environments cannot be ignored. This paper studies the high-speed integrated PCB signal integrity and power integrity. First, the basic concepts of high speed, high density, signal integrity and power integrity are clarified. The research status of signal integrity and power integrity at home and abroad is introduced. Finally, the basic causes and influencing factors and feasible solutions are studied.

引用

页码：412 / 416

页数：5