A New Method to Evaluate the In-plane Compression Behavior of Paperboard for the Deep Drawing Process

被引:1
作者
Lenske, Alexander [1 ]
Mueller, Tobias [2 ]
Ludat, Nicole [1 ]
Hauptmann, Marek [1 ,3 ]
Majschak, Jens-Peter [1 ]
机构
[1] Fraunhofer Inst Proc Technol IVV, Heidelbergerstr 20, D-01189 Dresden, Germany
[2] Tech Univ Dresden, Chair Proc Machines Proc Technol, Bergstr 120, D-01069 Dresden, Germany
[3] Steinbeis Hsch, Chair Packaging Machines & Packaging Technol, Ernst Augustin Str 15, D-12489 Berlin, Germany
关键词
In-plane compression; Friction behavior; Bending resistance; Empirical model; Paperboard; Tribocharging; Deep drawing process; 3D-forming; PACKAGING COMPONENTS; FRICTION;
D O I
10.15376/biores.17.2.2403-2427
中图分类号
TB3 [工程材料学]; TS [轻工业、手工业、生活服务业];
学科分类号
0805 ; 080502 ; 0822 ;
摘要
To evaluate the influence of different normal pressures and the fiber orientation on the in-plane compression behavior of paperboard during the deep drawing process, a new method was developed. In addition, the influence of the wrinkle formation on the dynamic coefficient of friction and the bending resistance was examined. To evaluate the eligibility of the in -plane compression testing method, a validation strategy was developed to compare the results from the new alternative tests with the punch force profiles from the deep drawing process within an empirical model.
引用
收藏
页码:2403 / 2427
页数:25
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