Spray cooling with mixtures of dielectric fluids

Spray cooling is one technology with the potential to help solve the thermal management issues of future generations of electronics. To date, however, its implementation has been limited by the lack of understanding of how spray coolig systems can be engineered rather than designed by trial and error. This work presents a comprehensive set of heat transfer data for single- and four-nozzle spray arrays using 5 different pure fluids and mixtures of pairs of these 5. Importantly, it was found that the heat transfer performance of the mixtures was not impaired as is often the case in convective flow boiling. In addition, a single correlation is presented that predicts all of the data to within 9% mean average error.