Two-phase closed thermosyphon vapor-chamber system for electronic cooling

被引：71

作者：

Tsai, Te-En ^{[1
]}

Wu, Hsin-Hsuan ^{[1
]}

Chang, Chih-Chung ^{[1
]}

Chen, Sih-Li ^{[1
]}

机构：

[1] Natl Taiwan Univ, Dept Mech Engn, Taipei 10764, Taiwan

来源：

INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER | 2010年 / 37卷 / 05期

关键词：

Thermosyphon; Vapor chamber; Thermal resistance; Boiling enhancement; Electronic cooling; HEAT-TRANSFER; PERFORMANCE; EVAPORATOR;

D O I：

10.1016/j.icheatmasstransfer.2010.01.010

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

This article experimentally investigates a two-phase closed thermosyphon vapor-chamber system for electronic cooling. A thermal resistance net work is developed in order to study the effects of heating power, fill ratio of working fluid, and evaporator surface structure on the thermal performance of the system. The results indicate that either a growing heating power or a decreasing fill ratio decreases the total thermal resistance, and the surface structure also influences the evaporator function prominently. A reasonable agreement with Rohesnow's empirical correlation is found for the evaporator. An optimum overall performance exists at 140W heating power and 20% fill ratio with sintered surface, and the corresponding total thermal resistance is 0.495 degrees C W-1. (C) 2010 Elsevier Ltd. All rights reserved.

引用

页码：484 / 489

页数：6

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