Experimental study of WL-CSP reliability subjected to a four-point bend-test

被引：10
|
作者：
Le Coq, Cedric [1 ,2 ]
Tougui, Adellah [2 ]
Stempin, Marie-Pascale [1 ]
Barreau, Laurent [1 ]
机构：
[1] STMicroelectronics, F-37071 Tours 2, France
[2] Univ Tours, LMR, F-37041 Tours, France
来源：
MICROELECTRONICS RELIABILITY | 2010年 / 50卷 / 07期
关键词：
FATIGUE;
D O I：
10.1016/j.microrel.2010.03.015
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This article deals with the reliability of WL-CSP subjected to a four-point bend-test according to the JEDEC standard and the repeatability of this test. The evaluation of the test repeatability shows a 5% variation on the characteristic Weibull parameter eta. Two dedicated failure detection methods are used: with an event detector and with data acquisition and no difference are observed. Parameters considered are pre-load magnitude and loading frequency. PCB strain due to pre-load is measured and its effect on the product reliability is evaluated. Based on these measurements a pre-load value is defined. It is also shown that a frequency of 3 Hz modifies the studied package lifetime. (C) 2010 Elsevier Ltd. All rights reserved.
引用
收藏
页码：1007 / 1013
页数：7
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