The effect of 0.5 wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads

被引：8

作者：

Lin, Hsiu-Jen ^{[1
,2
]}

Chuang, Tung-Han ^{[1
]}

机构：

[1] Natl Taiwan Univ, Inst Mat Sci & Engn, Taipei 106, Taiwan

[2] Ind Technol Res Inst, Mech & Syst Res Labs, Hsinchu 310, Taiwan

来源：

MATERIALS LETTERS | 2010年 / 64卷 / 04期

关键词：

Electromigration; Sn-9Zn; Sn-9Zn-0.5Ce; Diffusion; Rare-earth elements; WHISKER GROWTH; MICROSTRUCTURE; ALLOYS; JOINTS;

D O I：

10.1016/j.matlet.2009.11.058

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

It has previously been established that Sn-9Zn-0.5Ce alloy possesses mechanical properties superior to those of undoped Sn-9Zn alloy, and is free of the problem of rapid whisker growth. However, no detailed studies have been conducted on the electromigration behavior of Sn-9Zn-0.5Ce alloy. In this research, Sn-9Zn and Sn-9Zn-0.5Ce solder joints with Au/Ni(P)/Cu and Ag/Cu pads were stressed under a current density of 3.1 x 10(4) A/cm(2) at room temperature for various periods of time. Due to finer grain sizes, the electromigration effects were more severe in Sn-9Zn-0.5Ce solder joints than in Sn-9Zn solder joints when joint temperature was around 80 degrees C. In addition, both solder joints (Sn-9Zn and Sn-9Zn-0.5Ce) with Au/Ni (P)/Cu pads possess longer current-stressing lifetimes than those with Ag/Cu pads because Ni is more resistant than Cu to migration driven by electron flow. (C) 2009 Elsevier B.V. All rights reserved.

引用

页码：506 / 509

页数：4

共 15 条

[1] Size Effect of Rare-Earth Intermetallics in Sn-9Zn-0.5Ce and Sn-3Ag-0.5Cu-0.5Ce Solders on the Growth of Tin Whiskers [J].

Chuang, T. H. ;

Lin, H. J. .

METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2008, 39A (12) :2862-2866

[2] Temperature effects on the whiskers in rare-earth doped Sn-Mg-MCu-MCe solder joints [J].

Chuang, Tung-Han .

METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2007, 38A (05) :1048-1055

[3] Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder joints [J].

Chuang, Tung-Han .

SCRIPTA MATERIALIA, 2006, 55 (11) :983-986

[4] Microstructure and mechanical behavior of novel rare earth-containing Pb-free solders [J].

Dudek, M. A. ;

Sidhu, R. S. ;

Chawla, N. ;

Renavikar, M. .

JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (12) :2088-2097

[5] Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders [J].

Dudek, M. A. ;

Chawla, N. .

ACTA MATERIALIA, 2009, 57 (15) :4588-4599

[6] Electromigration of eutectic SnPb solder interconnects for flip chip technology [J].

Lee, TY ;

Tu, KN ;

Kuo, SM ;

Frear, DR .

JOURNAL OF APPLIED PHYSICS, 2001, 89 (06) :3189-3194

[7] Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints [J].

Lin, Hsiu-Jen ;

Chuang, Tung-Han .

JOURNAL OF ELECTRONIC MATERIALS, 2010, 39 (02) :200-208

[8] Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads [J].

Lin, W. H. ;

Wu, Albert T. ;

Lin, S. Z. ;

Chuang, T. H. ;

Tu, K. N. .

JOURNAL OF ELECTRONIC MATERIALS, 2007, 36 (07) :753-759

[9] In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing [J].

Lin, YH ;

Hu, YC ;

Tsai, CM ;

Kao, CR ;

Tu, KN .

ACTA MATERIALIA, 2005, 53 (07) :2029-2035

[10] Effect of current crowding and Joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature [J].

Nah, JW ;

Suh, JO ;

Tu, KN .

JOURNAL OF APPLIED PHYSICS, 2005, 98 (01)

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