Microstructure and Tensile Properties of Al-Cu-Si Alloy with Different Solidification Pressures

被引：3
|
作者：
Ouyang, X. X. [1 ]
Zhao, H. D. [1 ]
Zhang, K. W. [1 ]
Li, Y. Y. [1 ]
机构：
[1] S China Univ Technol, Sch Mech & Automot Engn, Guangzhou 510640, Guangdong, Peoples R China
来源：
ADVANCES IN MATERIALS MANUFACTURING SCIENCE AND TECHNOLOGY XIII, VOL II: MODERN DESIGN THEORY AND METHODOLOGY, MEMS AND NANOTECHNOLOGY, AND MATERIAL SCIENCE AND TECHNOLOGY IN MANUFACTURING | 2009年 / 628-629卷
关键词：
Al-Cu-Si Alloy; Microstructure; Silicon Particles; Tensile Property; SILICON PARTICLES; PARAMETERS;
D O I：
10.4028/www.scientific.net/MSF.628-629.593
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Microstructure and tensile properties of as-cast and T6-treated Al-4%Cu-3%Si alloy with different applied solidification pressures were investigated. The pressure has significant effect on the formed microstructure. It is observed that as the pressures increase, the porosities were removed, and the size and the secondary dendrite arm spacing of primary alpha-Al grains decreased evidently, and the morphology of eutectic Si particles changed from long acicular to small granular type. Hence, the tensile properties of the alloy were improved. The research has shown that the aspect ratio (A.R.) of the Si particles decreased after the solution and aging treatment. The A.R of the Si particles in the alloys with applied solidification pressure decreased more remarkably and this indicated that the Si particles can be more prone to be dissolved into a-Al matrix. Thus, the increase of the elongation was achieved.
引用
收藏
页码：593 / 598
页数：6
相关论文
共 50 条
  • [41] Effect of non-equilibrium heat treatments on microstructure and tensile properties of an Al-Si-Cu alloy
    Bacaicoa, I.
    Dwivedi, P. K.
    Luetje, M.
    Zeismann, F.
    Brueckner-Foit, A.
    Geisert, A.
    Fehlbier, M.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2016, 673 : 562 - 571
  • [42] Effects of rare earth elements on microstructure and tensile properties of Al-Si-Cu alloy at 250 °C
    Shuai-bo Zhang
    Yong Su
    Wen-gang Gong
    China Foundry, 2021, 18 : 474 - 480
  • [43] Catalyzed precipitation in Al-Cu-Si
    D. Mitlin
    J. W. Morris
    V. Radmilovic
    Metallurgical and Materials Transactions A, 2000, 31 : 2697 - 2711
  • [44] INFLUENCE OF MICROSTRUCTURE ON THE RESISTIVITY OF AL-CU-SI THIN-FILM INTERCONNECTS
    KIM, C
    SELITSER, SI
    MORRIS, JW
    JOURNAL OF APPLIED PHYSICS, 1994, 75 (02) : 879 - 884
  • [45] Influence of microstructure on the resistivity of Al-Cu-Si thin-film interconnects
    Kim, Choongun
    Selitser, S.I.
    Morris, J.W. Jr.
    1600, (75):
  • [46] Morphology and Phase Formation During the Solidification of Al-Cu-Si and Al-Ag-Cu Ternary Eutectic Systems
    Morando, Carina
    Fornaro, Osvaldo
    MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, 2018, 21 (02):
  • [47] Catalyzed precipitation in Al-Cu-Si
    Mitlin, D
    Radmilovic, V
    Morris, JW
    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2000, 31 (11): : 2697 - 2711
  • [48] On the Enhancement of the Microstructure and Tensile Properties of an Al-Cu Based Cast Alloy
    Girgis, A.
    Abdelaziz, M. H.
    Samuel, A. M.
    Valtierra, S.
    Samuel, F. H.
    METALLOGRAPHY MICROSTRUCTURE AND ANALYSIS, 2019, 8 (05) : 757 - 769
  • [49] Growth of β intermetallic in an Al-Cu-Si alloy during directional solidification via machine learned 4D quantification
    Cai, B.
    Kao, A.
    Lee, P. D.
    Boller, E.
    Basevi, H.
    Phillion, A. B.
    Leonardis, A.
    Pericleous, K.
    SCRIPTA MATERIALIA, 2019, 165 : 29 - 33
  • [50] Unveiling the mechanisms for Si addition on solidification microstructure and properties of Cu-Fe alloy
    Liu, Shichao
    Yue, Shipeng
    Jie, Jinchuan
    Xu, Songsong
    Dong, Yong
    Dong, Bowen
    Li, Xinzhong
    Li, Tingju
    JOURNAL OF ALLOYS AND COMPOUNDS, 2023, 938
12345