Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration

被引：0
|
作者：
Lee, Sungho [1 ]
Liang, Rui [2 ]
Miwa, Yuki [3 ]
Kino, Hisashi [4 ]
Fukushima, Takafumi [1 ]
Tanaka, Tetsu [1 ,2 ]
机构：
[1] Tohoku Univ, Dept Mech Syst Engn, Aoba Ku, 6-6-12 Aramaki Aza Aoba, Sendai, Miyagi 9808579, Japan
[2] Tohoku Univ, Dept Biomed Engn, Aoba Ku, 6-6-12 Aramaki Aza Aoba, Sendai, Miyagi 9808579, Japan
[3] Tohoku Univ, Dept Mech & Aerosp Engn, Aoba Ku, 6-6-12 Aramaki Aza Aoba, Sendai, Miyagi 9808579, Japan
[4] Tohoku Univ, Frontier Res Inst Interdisciplinary Sci, Aoba Ku, 3 Aramaki Aza Aoba, Sendai, Miyagi 9808578, Japan
来源：
PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2019年
关键词：
D O I：
10.23919/ltb-3d.2019.8735115
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Impact of temporary bonding conditions and temporary adhesive properties on mechanical stresses in multichip thinning is evaluated for high-yield multichip-to-wafer (MC2W) heterogeneous 3D integration. It turned out that no sidewall covering of chips with a temporary adhesive gives low mechanical stress to the chip edge, leading to less chipping and cracking.
引用
收藏
页码：17 / 17
页数：1
相关论文
共 50 条
  • [31] 300-mm Wafer 3D Integration Technology using Hybrid Wafer Bonding
    Hozawa, Kazuyuki
    Aoki, Mayu
    Hanaoka, Yuko
    Takeda, Kenichi
    2013 8TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2013, : 51 - 54
  • [32] A wafer-level 3D packaging structure with Benzocyclobutene as a dielectric for multichip module fabrication
    耿菲
    丁晓云
    徐高卫
    罗乐
    半导体学报, 2009, 30 (10) : 153 - 158
  • [33] Curing Behaviors of UV-Curable Temporary Adhesives for a 3D Multichip Package Process
    Seung-Woo Lee
    Tae-Hyung Lee
    Ji-Won Park
    Cho-Hee Park
    Hyun-Joong Kim
    Jun-Yeob Song
    Jae-Hak Lee
    Journal of Electronic Materials, 2014, 43 : 4246 - 4254
  • [34] A TECHNOLOGY FOR OPTICAL INTERCONNECTIONS BASED ON MULTICHIP INTEGRATION
    TSANG, DZ
    SMYTHE, DL
    CHU, A
    LAMBERT, JJ
    OPTICAL ENGINEERING, 1986, 25 (10) : 1127 - 1131
  • [35] A wafer-level 3D packaging structure with Benzocyclobutene as a dielectric for multichip module fabrication
    Geng Fei
    Ding Xiaoyun
    Xu Gaowei
    Luo Le
    JOURNAL OF SEMICONDUCTORS, 2009, 30 (10)
  • [36] Curing Behaviors of UV-Curable Temporary Adhesives for a 3D Multichip Package Process
    Lee, Seung-Woo
    Lee, Tae-Hyung
    Park, Ji-Won
    Park, Cho-Hee
    Kim, Hyun-Joong
    Song, Jun-Yeob
    Lee, Jae-Hak
    JOURNAL OF ELECTRONIC MATERIALS, 2014, 43 (11) : 4246 - 4254
  • [37] Temporary Wafer Bonding and Debonding for 3D Integration Using an Electrochemically Active Polymer Adhesive
    Gatty, Hithesh K.
    Schroder, Stephan
    Niklaus, Frank
    Roxhed, Niclas
    Stemme, Goran
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2014, 3 (05) : P115 - P121
  • [38] Conformal coatings for 3D multichip microsystem encapsulation
    Janting, J
    Branebjerg, J
    Rombach, P
    SENSORS AND ACTUATORS A-PHYSICAL, 2001, 92 (1-3) : 229 - 234
  • [39] New Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding
    Fukushima, T.
    Hashiguchi, H.
    Bea, J.
    Ohara, Y.
    Murugesan, M.
    Lee, K. -W.
    Tanaka, T.
    Koyanagi, M.
    2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2012,
  • [40] Wafer bonding for 3D integration of MEMS/CMOS
    Gracias, Alison
    Castracane, Jarnes
    Xu, Bai
    RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/ MOEMS V, 2006, 6111
12345